Abstract: The invention relates to a wafer chuck for handling a wafer, in particular in a wafer process device, further preferably in a scanning acoustic microscope, with a fixing device for the wafer, wherein the fixing device has a free space for receiving the wafer and a holder with multiple wafer contact fingers, which are movable relative to the holder for a wafer. The wafer contact fingers are arranged annularly around the free space for the wafer, preferably in one plane. The wafer contact fingers can be moved in the direction of the free space for the wafer or can be moved away from the free space for the wafer. One actuation device for the wafer contact fingers is provided and, when the actuation device is actuated, the wafer contact fingers are moved or can be moved simultaneously.

Abstract: The invention relates to an ultrasonic microscope for inspecting an object, comprising an object holder for holding the object in an object region; a scan head; a first transducer supported by the scan head and configured to emit first acoustic pulses along an emission direction, to focus the first acoustic pulses in a focal point, to detect second acoustic pulses emerging from the object and to output a first detection signal representing the second acoustic pulses detected by the first transducer; a first actuator configured to move the first transducer relative to the scan head along a vertical direction which is essentially parallel to the emission direction; and a controller configured to control the first actuator based on the first detection signal. Further, the invention relates to a carrier for carrying an acoustic pulse transducer of an ultrasonic microscope within an immersion liquid.

Abstract: A material processing system for processing a work piece is provided. The material processing is effected by supplying a reactive gas and energetic radiation for activation of the reactive gas to a surrounding of a location of the work piece to be processed. The radiation is preferably provided by an electron microscope. An objective lens of the electron microscope is preferably disposed between a detector of the electron microscope and the work piece. A gas supply arrangement of the material processing system comprises a valve disposed spaced apart from the processing location, a gas volume between the valve and a location of emergence of the reaction gas being small. The gas supply arrangement further comprises a temperature-adjusted, especially cooled reservoir for accommodating a starting material for the reactive gas.

Abstract: A material processing system for processing a work piece is provided. The material processing is effected by supplying a reactive gas and energetic radiation for activation of the reactive gas to a surrounding of a location of the work piece to be processed. The radiation is preferably provided by an electron microscope. An objective lens of the electron microscope is preferably disposed between a detector of the electron microscope and the work piece. A gas supply arrangement of the material processing system comprises a valve disposed spaced apart from the processing location, a gas volume between the valve and a location of emergence of the reaction gas being small. The gas supply arrangement further comprises a temperature-adjusted, especially cooled reservoir for accommodating a starting material for the reactive gas.

Abstract: A material processing system for processing a work piece is provided. The material processing is effected by supplying a reactive gas and energetic radiation for activation of the reactive gas to a surrounding of a location of the work piece to be processed. The radiation is preferably provided by an electron microscope. An objective lens of the electron microscope is preferably disposed between a detector of the electron microscope and the work piece. A gas supply arrangement of the material processing system comprises a valve disposed spaced apart from the processing location, a gas volume between the valve and a location of emergence of the reaction gas being small. The gas supply arrangement further comprises a temperature-adjusted, especially cooled reservoir for accommodating a starting material for the reactive gas.

Abstract: A material processing system for processing a work piece is provided. The material processing is effected by supplying a reactive gas and energetic radiation for activation of the reactive gas to a surrounding of a location of the work piece to be processed. The radiation is preferably provided by an electron microscope. An objective lens of the electron microscope is preferably disposed between a detector of the electron microscope and the work piece. A gas supply arrangement of the material processing system comprises a valve disposed spaced apart from the processing location, a gas volume between the valve and a location of emergence of the reaction gas being small. The gas supply arrangement further comprises a temperature-adjusted, especially cooled reservoir for accommodating a starting material for the reactive gas.

Abstract: A particle beam device, in particular an electron microscope, having at least two particle beam columns and one object slide having a receiving surface for receiving an object. The particle beam device makes it possible to align the surface of the object perpendicular to the beam axes of the particle beam columns, using simple means, in an accurate and error-free manner. The object slide assumes a basic position from which it may be tilted into the position in which the first or the second beam axis is perpendicular or at least almost perpendicular to the receiving surface of the object slide. In the basic position, a normal to the receiving surface of the object slide is spatially oriented such that an angle formed between the first beam axis and the normal is greater than or equal to an angle formed between the second beam axis and the normal.

Abstract: An arrangement and a method for the production of photomasks in which at least one defect control system is connected to at least one repair system by a stationary data connection or online connection, and the defect control system and repair system are connected to one another by data in such a way that the results obtained on one of the systems are immediately available to the other system for further processing. The defect control system conveys detected defects to the repair system via a data connection for data exchange. An AIMS system is advantageously provided as defect control system and an electron beam system is advantageously provided for defect control.

Abstract: A particle beam device, in particular an electron microscope, having at least two particle beam columns and one object slide having a receiving surface for receiving an object. The particle beam device makes it possible to align the surface of the object perpendicular to the beam axes of the particle beam columns, using simple means, in an accurate and error-free manner. The object slide assumes a basic position from which it may be tilted into the position in which the first or the second beam axis is perpendicular or at least almost perpendicular to the receiving surface of the object slide. In the basic position, a normal to the receiving surface of the object slide is spatially oriented such that an angle formed between the first beam axis and the normal is greater than or equal to an angle formed between the second beam axis and the normal.

Abstract: A material processing system for processing a work piece is provided. The material processing is effected by supplying a reactive gas and energetic radiation for activation of the reactive gas to a surrounding of a location of the work piece to be processed. The radiation is preferably provided by an electron microscope. An objective lens of the electron microscope is preferably disposed between a detector of the electron microscope and the work piece. A gas supply arrangement of the material processing system comprises a valve disposed spaced apart from the processing location, a gas volume between the valve and a location of emergence of the reaction gas being small. The gas supply arrangement further comprises a temperature-adjusted, especially cooled reservoir for accommodating a starting material for the reactive gas.

Abstract: An objective lens with magnetic and electrostatic focusing for an electron microscopy system is provided whose at least partially conical outer shape allows orienting an object to be imaged at a large angle range in respect of an electron beam, said objective lens exhibiting, at the same time, good optical parameters. This is enabled by a specific geometry of the lens elements. Furthermore, an examination for the simultaneous imaging and processing of an object is proposed which comprises, besides an electron microscopy system with the above-mentioned objective lens, also an ion beam processing system and an object support.

Abstract: An objective lens with magnetic and electrostatic focusing for an electron microscopy system is provided whose at least partially conical outer shape allows orienting an object to be imaged at a large angle range in respect of an electron beam, said objective lens exhibiting, at the same time, good optical parameters. This is enabled by a specific geometry of the lens elements. Furthermore, an examination for the simultaneous imaging and processing of an object is proposed which comprises, besides an electron microscopy system with the above-mentioned objective lens, also an ion beam processing system and an object support.