Abstract: A process for forming elongated solder terminals to connect a plurality of pads on a semiconductor device to a corresponding plurality of pads on a supporting substrate by,forming a means to maintain a predetermined vertical spacing between the semiconductor and the supporting substrate outside the area of the pads,forming and fixing solder extenders to each of the solder wettable pads on the substrate or the device to be joined,positioning the semiconductor device provided with solder mounds on the solder mountable pads over the supporting substrate with the solder mound in registry and with the pads on the substrate with the solder extenders positioned therebetween, the means to maintain vertical spacing located between and in abutting relation to the device and substrate, andheating the resulting assembly to reflow the solder mounds and the solder extenders while maintaining a predetermined spacing thus forming a plurality of hour-glass shaped elongated connections.