Patents by Inventor Peter Jares

Peter Jares has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6222732
    Abstract: The electrical unit has a printed circuit board (10) supporting the circuit, which includes a power component (11) which generates heat. In order to dissipate this heat from the power component, the power component rests on a heat conductive layer (13) which in turn is applied to the upper side (12) of the printed circuit board. This heat conductive layer further has a portion of the lid (18, 19) of the housing resting on it, which serves as a cooling area. Alternatively, the cooling area can be a free-standing cooling element. The heat transfer thus takes place via the heat conductive layer (13) to the cooling element (18, 19) so that the latter may be applied and formed independently of type and form of the power component.
    Type: Grant
    Filed: May 14, 1993
    Date of Patent: April 24, 2001
    Assignee: Robert Bosch GmbH
    Inventors: Gert Jakob, Joachim Zimmermann, Friedrich Horn, Hans Rummel, Thomas Sutter, Dieter Karr, Karl Schupp, Dieter Neuhaus, Dieter Hussmann, Peter Jares
  • Patent number: 6185100
    Abstract: In a control device the printed circuit board (10) rests on a rim (28) of the housing bottom (26). The power components (14) to be cooled are arranged in the area where the printed circuit board (10) rests on the rim (28). In order to achieve an even contact pressure of the printed circuit board (10) over the entire support surface, a contact pressure on the power component (14) or on the printed circuit board (10) is generated with the help of additional aids. It is possible here to use spring elements (30) or elastomer strips (31) acting on the power component (14). Furthermore, multi-part support elements (40), or respectively plastic elements (45) can also be employed, which respectively act directly on the printed circuit board (10). A good heat dissipation from the power component (14) via the rim (28) of the housing bottom is possible by means of this.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: February 6, 2001
    Assignee: Robert Bosch GmbH
    Inventors: Willy Bentz, Peter Jares, Dieter Karr, Paul Hermanutz, Waldemar Ernst
  • Patent number: 6128189
    Abstract: A device for dissipation of the thermal power loss of an electronic or electromechanical component (10) is proposed, in which an adequate cooling surface area is available. To obtain the largest possible cooling surface area at low assembly outlay, the components (1) have a heat-conducting connection with a metal-coated surface of a printed circuit board (2). The coated surface parts (5, 7) protrude as far as a connecting segment (10; 10a, 10b, 10c) of a housing (8, 9) that entirely or partially surrounds the printed circuit board (2). At least one connecting segment (10, 10a, 10b, 10c) of the housing (8, 9) is embodied in crowned fashion on its surface such, that upon fastening of the housing (8, 9) to the printed circuit board (2), a durable contact pressure between the housing (8, 9) and the printed circuit board (2) is exerted by the deformation of the crowned surface.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: October 3, 2000
    Assignee: Robert Bosch GmbH
    Inventors: Dieter Hussmann, Peter Jares, Thomas Jessberger, Didier Weber
  • Patent number: 6084776
    Abstract: A control device has at least two housing parts, at least one printed circuit board provided with power components and fastened in a peripheral region between the housing parts, the printed circuit board having a layer of a thermally conductive material, the housing parts of the printed circuit board having a first housing part and a second housing part formed so that the first housing part has a bearing face on the at least one printed circuit board which is larger at least in a region of the power components than a bearing face of to the second housing part, the layer being a filler which has good heat conduction and adhesion to the printed circuit board and to the first housing part.
    Type: Grant
    Filed: November 5, 1997
    Date of Patent: July 4, 2000
    Assignee: Robert Bosch GmbH
    Inventors: Harald Cuntz, Peter Jares, Dieter Karr
  • Patent number: 5418685
    Abstract: In order to provide protection against disruptive radiation and achieve good conduction of heat, a housing for control devices which has multiple parts is provided with a printed circuit board carrying power components and control elements with a peripherally extending lining of electrically and thermally conducting material. The printed circuit board is clamped between the housing halves in the region of the linings. The power components are contacted by the lining so as to be thermally conducting, while control elements which give off intensive disruptive radiation or are sensitive to such radiation are enclosed within connecting pieces projecting from the walls of the housing parts.
    Type: Grant
    Filed: October 14, 1993
    Date of Patent: May 23, 1995
    Assignee: Robert Bosch GmbH
    Inventors: Dieter Hussmann, Thomas Jessberger, Dieter Karr, Karl Schupp, Peter Jares, Dieter Neuhaus, Markus Harsch, Bernd Weber