Patents by Inventor PETER L. CHANG
PETER L. CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240069248Abstract: Anti-reflective optical structures are disclosed. The anti-reflective optical structures include sub-wavelength structures in order to produce one or more index of refraction gradients within the anti-reflective optical structures. The one or more index of refraction gradients can reduce reflection of light over a broad band of wavelengths.Type: ApplicationFiled: March 9, 2023Publication date: February 29, 2024Inventors: Mohamed Mahmoud, Huiyang Deng, Satyarth Suri, Jason S. Pelc, Peter L. Chang
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Patent number: 11909175Abstract: An optoelectronic device includes an off-cut III-V semiconductor substrate, a set of epitaxial layers formed on the off-cut III-V semiconductor substrate, and a horizontal cavity surface-emitting laser (HCSEL) having a laser resonant cavity formed in the set of epitaxial layers. The same or another optoelectronic device includes a semiconductor substrate; a laser, epitaxially grown on the semiconductor substrate and having a laser resonant cavity; a semiconductor device, epitaxially grown on the semiconductor substrate and separated from the laser by a single trench having a first vertical wall abutting the laser and a second vertical wall abutting the semiconductor device; and at least one coating on at least one of the first vertical wall or the second vertical wall. The laser resonant cavity of the laser has a horizontal portion parallel to the semiconductor substrate, and each of the first vertical wall and the second vertical wall is oriented perpendicular to the semiconductor substrate.Type: GrantFiled: January 13, 2021Date of Patent: February 20, 2024Assignee: Apple Inc.Inventors: Chih-Wei Chuang, Peter L. Chang, Tong Chen
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Patent number: 11569293Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.Type: GrantFiled: May 10, 2021Date of Patent: January 31, 2023Assignee: Intel CorporationInventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
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Publication number: 20220224077Abstract: An optoelectronic device includes an off-cut III-V semiconductor substrate, a set of epitaxial layers formed on the off-cut III-V semiconductor substrate, and a horizontal cavity surface-emitting laser (HCSEL) having a laser resonant cavity formed in the set of epitaxial layers. The same or another optoelectronic device includes a semiconductor substrate; a laser, epitaxially grown on the semiconductor substrate and having a laser resonant cavity; a semiconductor device, epitaxially grown on the semiconductor substrate and separated from the laser by a single trench having a first vertical wall abutting the laser and a second vertical wall abutting the semiconductor device; and at least one coating on at least one of the first vertical wall or the second vertical wall. The laser resonant cavity of the laser has a horizontal portion parallel to the semiconductor substrate, and each of the first vertical wall and the second vertical wall is oriented perpendicular to the semiconductor substrate.Type: ApplicationFiled: January 13, 2021Publication date: July 14, 2022Inventors: Chih-Wei Chuang, Peter L. Chang, Tong Chen
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Publication number: 20210327957Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.Type: ApplicationFiled: May 10, 2021Publication date: October 21, 2021Inventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
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Patent number: 11004894Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.Type: GrantFiled: May 19, 2020Date of Patent: May 11, 2021Assignee: Intel CorporationInventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
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Patent number: 10886153Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.Type: GrantFiled: December 18, 2018Date of Patent: January 5, 2021Assignee: Intel CorporationInventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng
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Publication number: 20200350360Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.Type: ApplicationFiled: May 19, 2020Publication date: November 5, 2020Inventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
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Patent number: 10658422Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.Type: GrantFiled: December 27, 2018Date of Patent: May 19, 2020Assignee: Intel CorporationInventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
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Publication number: 20190148188Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.Type: ApplicationFiled: December 18, 2018Publication date: May 16, 2019Applicant: Intel CorporationInventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng
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Publication number: 20190131345Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.Type: ApplicationFiled: December 27, 2018Publication date: May 2, 2019Applicant: Intel CorporationInventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
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Patent number: 10242892Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.Type: GrantFiled: October 17, 2014Date of Patent: March 26, 2019Assignee: Intel CorporationInventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng
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Patent number: 10204808Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.Type: GrantFiled: October 17, 2014Date of Patent: February 12, 2019Assignee: Intel CorporationInventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng
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Patent number: 10177195Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.Type: GrantFiled: September 30, 2016Date of Patent: January 8, 2019Assignee: Intel CorporationInventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
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Patent number: 10128307Abstract: Crystalline (micro)LED display assemblies, methods of fabricating such display assemblies, crystalline LED source substrates from which the (micro)LEDs may be transferred to the display assembly, and methods of fabricating such source substrates. LED elements may be prepared for transfer by pick-n-place or other means to a bonding substrate. Anchor and release structures enable LED elements to be affixed and electrically coupled to a bonding substrate with conductive polymer. LED elements may be prepared for transfer to a bonding substrate with self-aligned LED electrode metallization structures enabling the elements to be affixed to a bonding substrate with an adhesive and electrically coupled with a self-aligned local interconnect metallization. After affixing the LED elements, material may be built-up around the LED elements and the display assembly separated from the bonding substrate.Type: GrantFiled: October 17, 2014Date of Patent: November 13, 2018Assignee: Intel CorporationInventor: Peter L. Chang
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Patent number: 10054737Abstract: Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor.Type: GrantFiled: November 15, 2016Date of Patent: August 21, 2018Assignee: INTEL CORPORATIONInventors: Mauro J Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. Chang, Bruce A. Block, Johanna M. Swan
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Publication number: 20180233536Abstract: Crystalline (micro) LED display assemblies, methods of fabricating such display assemblies, crystalline LED source substrates from which the (micro) LEDs may be transferred to the display assembly, and methods of fabricating such source substrates. LED elements may be prepared for transfer by pick-n-place or other means to a bonding substrate. Anchor and release structures enable LED elements to be affixed and electrically coupled to a bonding substrate with conductive polymer. LED elements may be prepared for transfer to a bonding substrate with self-aligned LED electrode metallization structures enabling the elements to be affixed to a bonding substrate with an adhesive and electrically coupled with a self-aligned local interconnect metallization. After affixing the LED elements, material may be built-up around the LED elements and the display assembly separated from the bonding substrate.Type: ApplicationFiled: October 17, 2014Publication date: August 16, 2018Inventor: Peter L. Chang
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Publication number: 20180097033Abstract: A micro-light emitting diode (LED) display panel and a method of forming the display panel, the micro-LED display panel having a monolithically grown micro-structure including a first color micro-LED that is a first color nanowire LED, and a second color micro-LED that is a second color nanowire LED.Type: ApplicationFiled: September 30, 2016Publication date: April 5, 2018Inventors: Khaled Ahmed, Kunjal Parikh, Peter L. Chang
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Patent number: 9922592Abstract: In one example, a method for controlling a display with a digital signal includes detecting a binary value from a timing controller, the binary value corresponding to a portion of an image to be displayed. The method can also include determining a previous binary value from the timing controller and calculating a difference between the binary value from the timing controller and the previous binary value from the timing controller. Furthermore, the method can include generating an encoded signal based on the difference and transmitting the encoded signal to a display panel.Type: GrantFiled: December 23, 2015Date of Patent: March 20, 2018Assignee: INTEL CORPORATIONInventors: Kunjal Parikh, Khaled Ahmed, Prakash K. Radhakrishnan, Peter L. Chang, Ravi Ranganathan
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Publication number: 20170278733Abstract: Micro pick-and-bond heads, assembly methods, and device assemblies. In, embodiments, micro pick-and-bond heads transfer micro device elements, such as (micro) LEDs, en masse from a source substrate to a target substrate, such as a LED display substrate. Anchor and release structures on the source substrate enable device elements to be separated from a source substrate, while pressure sensitive adhesive (PSA) enables device elements to be temporarily affixed to pedestals of a micro pick-and-bond head. Once the device elements are permanently affixed to a target substrate, the PSA interface may be defeated through peeling and/or thermal decomposition of an interface layer.Type: ApplicationFiled: October 17, 2014Publication date: September 28, 2017Inventors: Peter L. Chang, Chytra Pawashe, Michael C. Mayberry, Jia-Hung Tseng