Abstract: A consumption meter, e.g. a water or heat meter, for measuring a flow rate of a fluid supplied in a flow tube. First and second ultrasonic transducers are arranged at the flow tube for transmitting and receiving ultrasonic signals transmitted through the fluid and operated by a flow measurement sub-circuit for generating a signal indicative of the flow rate of the fluid. A noise measurement sub-circuit operates a sensor arranged at the flow tube for detection of acoustic signals of the flow tube, and being arranged to generate a signal indicative of a noise level of the flow tube accordingly. This sensor may comprise a separate transducer, or the sensor may be constituted by one or both of the first and second ultrasonic transducers. The consumption meter may communicate data representative of the noise level via a communication module along with data consumed amount of water, heat etc.

Abstract: A cold plate for a liquid cooling system configured for cooling a heat generating electronic component is described. The cold plate may have a heat exchanging interface having a first surface and a second surface for contacting the heat generating electronic component opposite the first surface. The cold plate may also have a plurality of parallel fins extending from the first surface, the plurality of fins defining a plurality of channels. The cold plate may further have a plurality of slots formed in the plurality of fins transversely to the plurality of channels. The cold plate may also include a plurality of barrier walls that extend down into the plurality of slots. The cold plate may further include a seal that has an inlet passage configured to direct a cooling liquid to the plurality of channels.

Abstract: A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: A liquid cooling system for an electronic system includes a plurality of cooling modules that are adapted to circulate a liquid coolant therethrough. Each cooling module is configured to be coupled to a circuit board of the electronic system and placed in thermal contact with one of a plurality of heat-generating electronic components on the circuit board. The cooling system also includes a plurality of heat exchangers that are configured to dissipate heat from the liquid coolant to air. Each heat exchanger of the plurality of heat exchangers is fluidly coupled between two cooling modules of the plurality of cooling modules in a flow path of the liquid. The cooling system also includes a plurality of conduits that fluidly couple the plurality of cooling modules to the plurality of heat exchangers.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: Disclosed is a tablet dispenser for consecutive administering of tablets, the dispenser having a circular container (21) in which tablets are stored in a number of compartments (24) along the perimeter of the container, and a circular lid (22) concentric with the container, which lid (24) covers the compartments (24) and has a dispensing opening allowing access to one compartment at the time when the lid is rotated relative to the container. A cylindrical surface on the container part forms a pawl wheel provided with teeth (32) each having a ramp shaped and a steep edge and the lid (22) is provided with elongated, flexible pawls (30) which are at one end fixed to the lid (22) and follows a chord of the circular device to engage the teeth (32) of the pawl wheel by its other free end.