Patents by Inventor Peter Oeschay

Peter Oeschay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7383416
    Abstract: A method for setting an address of a rank in a memory module having a number of memory chips distributed along a byte lane includes setting the first memory chip of the byte lane to have a first rank address, generating a second rank address therein from the first rank address, and driving the second rank address to a second one of the memory chips. Alternatively, the first rank address may be driven to the second memory chip, and then, a second rank address is generated in that second memory chip. Further, the second memory chip is set to have the second rank address in response to the driving the second/first rank address. A power-up sequence after voltage supply, or command signals sent via a serial management bus or the command address bus can be used to initiate the setting of ranks. The rank addresses are re-driven to adjacent memory chips by DQ-lines along a byte lane.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: June 3, 2008
    Assignee: Infineon Technologies AG
    Inventors: Peter Oeschay, Hermann Ruckerbauer
  • Publication number: 20070205498
    Abstract: A signal routing technique for a multilayered printed circuit board is provided. The multilayered printed circuit board comprises a top layer, a bottom layer and at least one internal layer. Signals for a first subset of a plurality of higher speed buses are routed in stripline on the first internal layer. Signals for a second subset of said plurality of higher speed buses in microstrip on the top layer.
    Type: Application
    Filed: December 15, 2006
    Publication date: September 6, 2007
    Applicant: QIMONDA NORTH AMERICA CORP.
    Inventors: Srdjan Djordjevic, Peter Oeschay
  • Publication number: 20070189049
    Abstract: A semiconductor memory module having a plurality of memory chips and at least one bus connecting the plurality of memory chips is provided. The bus has two branches, a first connected to a greater quantity of memory chips than a second branch.
    Type: Application
    Filed: February 16, 2006
    Publication date: August 16, 2007
    Inventors: Srdjan Djordjevic, Peter Oeschay
  • Publication number: 20060265543
    Abstract: A method for setting an address of a rank in a memory module having a number of memory chips distributed along a byte lane includes setting the first memory chip of the byte lane to have a first rank address, generating a second rank address therein from the first rank address, and driving the second rank address to a second one of the memory chips. Alternatively, the first rank address may be driven to the second memory chip, and then, a second rank address is generated in that second memory chip. Further, the second memory chip is set to have the second rank address in response to the driving the second/first rank address. A power-up sequence after voltage supply, or command signals sent via a serial management bus or the command address bus can be used to initiate the setting of ranks. The rank addresses are re-driven to adjacent memory chips by DQ-lines along a byte lane.
    Type: Application
    Filed: May 17, 2005
    Publication date: November 23, 2006
    Inventors: Peter Oeschay, Hermann Ruckerbauer