Patents by Inventor Peter-Oliver Hangweier

Peter-Oliver Hangweier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device and method for processing of wafers
    Patent number: 9771223
    Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
    Type: Grant
    Filed: July 23, 2013
    Date of Patent: September 26, 2017
    Assignee: EV Group GmbH
    Inventors: Friedrich Paul Lindner, Peter Oliver Hangweier
  • Device and method for processing wafers
    Patent number: 9751698
    Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: September 5, 2017
    Assignee: EV GROUP GMBH
    Inventors: Friedrich Paul Lindner, Peter-Oliver Hangweier
  • PRESSURE TRANSFER PLATE FOR PRESSURE TRANSFER OF A BONDING PRESSURE
    Publication number: 20150047783
    Abstract: A pressure transfer plate for transferring a bonding pressure, especially in thermocompression bonding, from a pressurization apparatus to a wafer, comprising a first pressure side for making contact with a pressurization apparatus, a second pressure side facing away from the first pressure side having an effective contact area for making contact with the wafer and pressurizing it, at least the effective contact area having a low adhesiveness relative to the wafer.
    Type: Application
    Filed: March 19, 2012
    Publication date: February 19, 2015
    Applicant: EV GROUP E. THALLNER GMBH
    Inventors: Jurgen Burggraf, Peter-Oliver Hangweier, Christian Perau
  • DEVICE AND METHOD FOR PROCESSING OF WAFERS
    Publication number: 20130309046
    Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
    Type: Application
    Filed: July 23, 2013
    Publication date: November 21, 2013
    Applicant: EV Group GmbH
    Inventors: Friedrich Paul Lindner, Peter-Oliver Hangweier
  • DEVICE AND METHOD FOR PROCESSING WAFERS
    Publication number: 20130240113
    Abstract: The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
    Type: Application
    Filed: October 5, 2011
    Publication date: September 19, 2013
    Applicant: EV GROUP GMBH
    Inventors: Friedrich Paul Lindner, Peter-Oliver Hangweier