Abstract: A semiconductor structure comprises a first wafer and a second wafer, between which a glue layer can be used for combination. The first wafer comprises a first semiconductor cell structure, and a surface of the first wafer comprises conductive pads electrically connected to the first semiconductor cell structure. The second wafer comprises a second semiconductor cell structure and is bonded to the surface of the first wafer having the conductive pads. The first and second semiconductor cell structures are electrically connected through the conductive pads, and the conductive pads are formed around each die of the first wafer. The density of the first semiconductor cell structure in the first wafer is larger than the density of the second semiconductor cell structure in the second wafer.

Abstract: A method for manufacturing a multi-layer semiconductor structure is disclosed. First, a first wafer comprising a first semiconductor device structure and a second wafer comprising a substrate and a single crystal silicon layer are provided, and the first and second wafers are combined in which a surface of the first wafer having the first semiconductor device structure is in contact with a surface of the second wafer having the single crystal silicon layer. A glue layer and a dielectric layer can be employed to combine the first and second wafers. Afterwards, a process for manufacturing a second semiconductor device structure is performed on the single crystal silicon layer.

Abstract: A system and method to reduce echoes in voice communications are described. Input data containing return loss values of a communication trunk within a communications network is received, the return loss values being measured at each frequency of a plurality of frequencies within a predetermined frequency band. An optimum transhybrid balance impedance is calculated from the input data. Finally, the optimum transhybrid balance impedance is transmitted to a user for further processing.

Abstract: A system and method to reduce echoes in voice communications are described. Input data containing return loss values of a communication trunk within a communications network is received, the return loss values being measured at each frequency of a plurality of frequencies within a predetermined frequency band. An optimum transhybrid balance impedance is calculated from the input data. Finally, the optimum transhybrid balance impedance is transmitted to a user for further processing.

Abstract: An embodiment of the present invention is a power generator which provides a power waveform for applying power to ringing circuits and message-waiting lamps (Ring/MWL) in standard analog telephones in a PBX and which power generator reduces power dissipation. In particular, an embodiment of the inventive power generator includes: (a) a controller which generates a low-level signal representing the power waveform and a timing and control signal indicative of various portions of the low-level analog signal; (b) a circuit, responsive to the timing and control signal, which alters the output of a power supply; and (c) a power amplifier, responsive to the low-level signal and the output of the power supply, which amplifies the low-level signal to produce the power waveform.