Patents by Inventor Peter Riel
Peter Riel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11022491Abstract: The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected pass through.Type: GrantFiled: April 14, 2020Date of Patent: June 1, 2021Assignee: ams Sensors Singapore Pte. LtdInventors: Peter Riel, Peter Roentgen
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Patent number: 10741613Abstract: The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.Type: GrantFiled: October 14, 2015Date of Patent: August 11, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Stephan Heimgartner, Alexander Bietsch, Peter Riel
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Publication number: 20200249087Abstract: The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected pass through.Type: ApplicationFiled: April 14, 2020Publication date: August 6, 2020Inventors: Peter Riel, Peter Roentgen
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Patent number: 10667387Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.Type: GrantFiled: April 18, 2018Date of Patent: May 26, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventor: Peter Riel
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Patent number: 10656014Abstract: The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected wavelength or narrow range of wavelengths to pass through.Type: GrantFiled: September 23, 2015Date of Patent: May 19, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Peter Riel, Peter Roentgen
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Patent number: 10566363Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.Type: GrantFiled: August 14, 2017Date of Patent: February 18, 2020Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
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Patent number: 10343899Abstract: The method for manufacturing an object comprises the steps of (a) providing a wafer comprising a multitude of semi-finished objects; (b) separating said wafer into parts referred to as sub-wafers, at least one of said sub-wafers comprising a plurality of said semi-finished objects; (c) processing at least a portion of said plurality of semi-finished objects by subjecting said at least one sub-wafer to at least one processing step; and preferably also the step of (d) separating said at least one sub-wafer into a plurality of parts.Type: GrantFiled: October 1, 2012Date of Patent: July 9, 2019Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Peter Riel, Hartmut Rudmann, Markus Rossi
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Patent number: 10302279Abstract: The present disclosure describes light conversion modules each having a single laser diode or multiple laser diodes. The light conversion modules can be particularly small in size (height and lateral footprint) and can overcome various challenges associated with the high optical power and heat emitted by laser diodes. In some implementations, the light conversion modules include glass phosphors, which, in some instances, can resist degradation caused by the optical power and/or heat generated by the laser diodes. In some instances, the light conversion modules include optical filters which, in some instances, can reduce or eliminate human eye-safety risk.Type: GrantFiled: June 9, 2017Date of Patent: May 28, 2019Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Markus Rossi, Peter Riel, Peter Roentgen
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Publication number: 20180315911Abstract: An electrical-contact assembly includes electrical contacts with first and second electrical-contact surfaces on opposing sides of the assembly. The electrical-contact assembly is manufactured by a structurable process (e.g., photo-structurable process) and by electroplating. The first and second electrical-contact surfaces can be positioned with respect to each other with an accuracy, for example, of at least 5 microns. Further, the thickness of the electrical-contact assembly can be at most 17 microns in some cases. The electrical-contact assembly can include integrated active optoelectronic elements, overmolds, optical elements and non-transparent walls.Type: ApplicationFiled: October 24, 2016Publication date: November 1, 2018Inventors: Bojan Tesanovic, Peter Riel
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Publication number: 20180235080Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.Type: ApplicationFiled: April 18, 2018Publication date: August 16, 2018Applicant: Heptagon Micro Optics Pte. Ltd.Inventor: Peter Riel
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Publication number: 20170356622Abstract: The present disclosure describes light conversion modules each having a single laser diode or multiple laser diodes. The light conversion modules can be particularly small in size (height and lateral footprint) and can overcome various challenges associated with the high optical power and heat emitted by laser diodes. In some implementations, the light conversion modules include glass phosphors, which, in some instances, can resist degradation caused by the optical power and/or heat generated by the laser diodes. In some instances, the light conversion modules include optical filters which, in some instances, can reduce or eliminate human eye-safety risk.Type: ApplicationFiled: June 9, 2017Publication date: December 14, 2017Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Markus Rossi, Peter Riel, Peter Roentgen
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Publication number: 20170343889Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.Type: ApplicationFiled: August 14, 2017Publication date: November 30, 2017Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
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Publication number: 20170309685Abstract: The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.Type: ApplicationFiled: October 14, 2015Publication date: October 26, 2017Inventors: Stephan Heimgartner, Alexander Bietsch, Peter Riel
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Publication number: 20170299433Abstract: The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected wavelength or narrow range of wavelengths to pass through.Type: ApplicationFiled: September 23, 2015Publication date: October 19, 2017Inventors: Peter Riel, Peter Roentgen
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Patent number: 9768361Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.Type: GrantFiled: July 22, 2015Date of Patent: September 19, 2017Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
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Publication number: 20160306265Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.Type: ApplicationFiled: July 22, 2015Publication date: October 20, 2016Inventors: Peter Riel, Markus Rossi, Daniel Pérez Calero, Matthias Gloor, Moshe Doron, Dmitry Bakin, Philippe Bouchilloux
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Publication number: 20160057855Abstract: One or more channels are provided in the surface of a conductive layer of a PCB substrate in an area on which a component is to be placed. The channels can help reduce or prevent shifting of the component during reflow soldering through surface tension/capillary forces of the solder paste material in the channels. Such channels also can be used, for example, by an image processing system to facilitate accurate positioning and/or alignment of the component. The image processing system can use the location of the channels alone, or in combination with other features such as a solder mask or other alignment marks, to position and/or align the component with high accuracy.Type: ApplicationFiled: April 11, 2014Publication date: February 25, 2016Inventor: Peter Riel
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Publication number: 20140295122Abstract: The method for manufacturing an object comprises the steps of (a) providing a wafer comprising a multitude of semi-finished objects; (b) separating said wafer into parts referred to as sub- wafers, at least one of said sub-wafers comprising a plurality of said semi-finished objects; (c) processing at least a portion of said plurality of semi-finished objects by subjecting said at least one sub-wafer to at least one processing step; and preferably also the step of (d) separating said at least one sub-wafer into a plurality of parts.Type: ApplicationFiled: October 1, 2012Publication date: October 2, 2014Inventors: Peter Riel, Hartmut Rudmann, Markus Rossi
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Publication number: 20130286686Abstract: The invention relates to an optical light guide element (1) having a first end section (8) with a light entrance area (6) designed for facing a light-transparent opening (50) and having a second end section (9) with a light exit area (7) designed for facing a light sensor (52), wherein the light entrance area (6) is defined by a surface area on the optical light guide element (1) which faces the light-transparent opening (50) and the first end section (8) forms an inclined surface area (2) which has an acute angle with the surface area of the light entrance area (6).Type: ApplicationFiled: November 23, 2011Publication date: October 31, 2013Inventors: Ville Kettunen, Peter Riel, Hartmut Rudmann, Markus Rossi
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Patent number: D799103Type: GrantFiled: May 20, 2016Date of Patent: October 3, 2017Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Matthias Gloor, Martin Lukas Balimann, Peter Riel