Patents by Inventor Peter Robert Lawrence Kaiser

Peter Robert Lawrence Kaiser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing process and heat dissipating device for forming interface for electronic component
    Patent number: 8941234
    Abstract: A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.
    Type: Grant
    Filed: April 1, 2014
    Date of Patent: January 27, 2015
    Assignee: DY 4 Systems, Inc.
    Inventors: Ivan Straznicky, Peter Robert Lawrence Kaiser, Steven Drennan, Marc-Jason Renaud, Georges Francis Marquis
  • MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTERFACE FOR ELECTRONIC COMPONENT
    Publication number: 20140209284
    Abstract: A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.
    Type: Application
    Filed: April 1, 2014
    Publication date: July 31, 2014
    Applicant: DY 4 Systems, Inc.
    Inventors: Ivan Straznicky, Peter Robert Lawrence Kaiser, Steven Drennan, Marc-Jason Renaud, Georges Francis Marquis
  • Manufacturing process and heat dissipating device for forming interface for electronic component
    Patent number: 8728872
    Abstract: A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: May 20, 2014
    Assignee: DY 4 Systems, Inc.
    Inventors: Ivan Straznicky, Peter Robert Lawrence Kaiser, Steven Drennan, Marc-Jason Renaud, Georges Francis Marquis
  • MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTERFACE FOR ELECTRONIC COMPONENT
    Publication number: 20130043015
    Abstract: A method includes preparing a bonding surface of a heat dissipating member, applying flux to the bonding surface of the heat dissipating member, and removing excess flux from the bonding surface so that minimal flux is provided. The method also includes preparing a die surface of an electronic device package, applying flux to the die surface, and removing excess flux from the die surface so that minimal flux is provided. The method further includes positioning a preform solder component on the die surface, positioning the heat dissipating member over the die surface and the preform solder component such that the flux layer of the bonding surface is in contact with the preform solder component, and reflowing the solder component using a reflow oven. A heat spreader is also described for use in the process.
    Type: Application
    Filed: August 18, 2011
    Publication date: February 21, 2013
    Applicant: DY 4 Systems, Inc.
    Inventors: Ivan Straznicky, Peter Robert Lawrence Kaiser, Steven Drennan, Marc-Jason Renaud, Georges Francis Marquis