Abstract: A Secure Enclave SiP (SE-SiP) is disclosed. The SE-SiP provides all the security benefits of a system designed using a Trusted Platform Module (TPM), replaces the need to trust a general-purpose CPU chip vendor with the need to trust a much simpler more trustworthy configurable device, and replaces the need to trust the entire system motherboard manufacturer with the much more limited need to trust the SE-SiP manufacturer. It can provide privacy for the software and data sent to the system, resident on it, or retrieved from it, with respect to all parties—including the person/party in physical possession of the device.

Abstract: High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.

Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be reconfigured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

Abstract: Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.

Abstract: In one or more embodiments, an encryption key of a device may be split into multiple segments. One of the segments may be retained by an owner of the device, and some of the segments may be distributed to multiple entities. For example, one of the segments may be provided to a service provider, and one of the segments may be provided to an escrow agent. The escrow agent may process its segment, provide information based on its segment to a public ledger, and destroy its segment. A proxy agent may retrieve, from the public ledger, the information based on the segment provided to the escrow agent and obtain compensation. When the proxy agent obtains the compensation, the public ledger exhibits information utilizable to obtain the segment provided to the escrow agent. With the segments provided to the escrow agent and the service provider, the encryption key may be obtained.

Abstract: Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.

Abstract: High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.

Abstract: Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.

Abstract: Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.

Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

Abstract: In one or more embodiments, an encryption key of a device may be split into multiple segments. One of the segments may be retained by an owner of the device, and some of the segments may be distributed to multiple entities. For example, one of the segments may be provided to a service provider, and one of the segments may be provided to an escrow agent. The escrow agent may process its segment, provide information based on its segment to a public ledger, and destroy its segment. A proxy agent may retrieve, from the public ledger, the information based on the segment provided to the escrow agent and obtain compensation. When the proxy agent obtains the compensation, the public ledger exhibits information utilizable to obtain the segment provided to the escrow agent. With the segments provided to the escrow agent and the service provider, the encryption key may be obtained.