Patents by Inventor Peter Romeder

Peter Romeder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for treating semiconductor material with an acid-containing fluid
    Patent number: 5587046
    Abstract: A process for treating semiconductor material with an acid-containing fluid, has water being formed as a product of a chemical reaction. Before and/or during the treatment of the semiconductor material, phosphorus pentoxide is added to the acid-containing fluid.
    Type: Grant
    Filed: April 10, 1995
    Date of Patent: December 24, 1996
    Assignee: Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Aktiengesellschaft
    Inventors: Maximilian Stadler, Gunter Schwab, Peter Romeder, Gabriele Trifellner
  • Process for the wet-chemical treatment of disk-shaped workpieces
    Patent number: 5451267
    Abstract: A process for the wet-chemical treatment of workpieces, especially of semiconductor wafers, includes exposing the workpieces to a flow of a gassified treatment medium generated by homogeneously dispersing gas bubbles in a liquid.
    Type: Grant
    Filed: May 11, 1994
    Date of Patent: September 19, 1995
    Assignee: Wacker Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
    Inventors: Max Stadler, Gunter Schwab, Peter Romeder
  • Magazine for holding disk-type workpieces in particular semiconductor wafers during wet-chemical surface treatment in liquid baths
    Patent number: 5236548
    Abstract: A magazine is provided for holding disk-type workpieces, in particular seonductor wafers, in the wet-chemical surface treatment in liquid baths. The magazine is particularly useful for etching semiconductor wafers in a liquid bath, which contains an insert (5) which has a diameter of 1.1-1.9 times the diameter of the wafer (6) and which has arrangements of guide strut assemblies (12) held parallel at a spacing of at least twice the wafer thickness by spacing struts (8). The guide strut assemblies (12) comprise main guide struts (9) and subsidiary guide struts (10) which diverge at the linking points (13), which do not lie on the housing axis, in not more than three directions. This etching magazine makes possible a marked reduction in the deterioration in the wafer geometry normally observed in etching treatments.
    Type: Grant
    Filed: January 21, 1992
    Date of Patent: August 17, 1993
    Assignee: Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe mbH
    Inventors: Maximilian Stadler, Schwab Gunter, Peter Romeder