Abstract: A circuit includes: a first resonator; a temperature compensation circuit including a resonator group-delay analyzer and a second resonator; oscillator control circuitry; and a controller. The resonator group-delay analyzer is configured to determine a group-delay parameter responsive to operations of the second resonator. The controller is configured to provide a control signal responsive to the group-delay parameter. The oscillator control circuitry is configured to adjust a frequency of an output signal of the oscillator control circuitry responsive to the control signal.

Abstract: A method includes receiving, by a piezoelectric stack of a transducer, a first piezoelectric voltage. The transducer has a base structure and a first layer, the base structure having a first displacement between a first portion of the base structure and the first layer. The method also includes transmitting, by the transducer, a first ultrasound frequency while receiving a first piezoelectric voltage, and receiving, by the transducer, a first bias voltage. The received first bias voltage alters the first displacement between the first portion of the base structure and the first layer, and the altered first displacement is smaller than the first displacement. The method further includes receiving, by the piezoelectric stack of the transducer, a second piezoelectric voltage to the transducer, and transmitting, by the transducer, a second ultrasound frequency while receiving the first bias voltage and the second piezoelectric voltage.

Abstract: A laterally vibrating bulk acoustic wave (LVBAW) resonator includes a piezoelectric plate sandwiched between first and second metal layers. The second metal layer is patterned into an interdigital transducer (IDT) with comb-shaped electrodes having interlocking fingers. The width and pitch of the fingers of the electrodes determine the resonant frequency. A combined thickness of the first and second metal layers and the piezoelectric layer is less than the pitch of the interlocking fingers.

Abstract: In one embodiment, a transducer comprises a first piezoelectric stack comprising a piezoelectric material; a first layer in contact with the piezoelectric stack; and a base structure beneath the first layer. The first layer has a first displacement between a first portion of the base structure and the first layer, and the first displacement is configurable by a first bias voltage received by the transducer.

Abstract: A laterally vibrating bulk acoustic wave (LVBAW) resonator includes a piezoelectric plate sandwiched between first and second metal layers. The second metal layer is patterned into an interdigital transducer (IDT) with comb-shaped electrodes having interlocking fingers. The width and pitch of the fingers of the electrodes determine the resonant frequency. A combined thickness of the first and second metal layers and the piezoelectric layer is less than the pitch of the interlocking fingers.

Abstract: A torque sensor chip including a semiconductor substrate, an acoustic reflector formed on the semiconductor substrate, and first and second Lamb wave resonators (LWRs). The first LWR is formed on a side of the acoustic reflector opposite the semiconductor substrate. The first LWR is at a first angle with respect to an axis of the IC. The second LWR also is formed on the side of the acoustic reflector opposite the semiconductor substrate. The second LWR is at a second angle, different than the first angle, with respect to the axis of the IC.

Abstract: An encapsulation chip manufacturing method includes forming first and second dicing grooves in a surface of a cap wafer and aligning the cap wafer and a device substrate such that the surface of the cap wafer faces a surface of the device substrate. The device substrate includes a device affixed to the surface and a bond pad on the surface and coupled to the device. The cap wafer is bonded to the device substrate and partially diced at the first and second dicing grooves such that the bond pad is exposed. Aligning the cap wafer and the device substrate includes aligning the first and second dicing grooves between the bond pad and a bonding area at which the cap wafer is bonded to the device substrate. A width of the first and second dicing grooves prevents cap wafer dust formed during the partial dicing from falling on the bond pad.

Abstract: An interposer to be used in a device for delivering medication to a patient is disclosed. The device includes a reservoir for storing the medication and a needle for releasing the medication in the patient, the interposer configured to mount the reservoir and needle. The interposer comprises a channel for distributing the medication from the reservoir to the needle, a thin membrane defining a portion of the channel as a chamber for receiving the medication, and a piezoelectric transducer positioned on the thin membrane that functions as an actuator for moving the thin membrane toward and away from the chamber of the channel.

Abstract: A device is disclosed that is configured as a fully autonomous and integrated wearable apparatus for diabetes management. The device comprises a reservoir for storing the medication for subsequent delivery to a patient, a needle for delivering the medication to the patient subcutaneously, a micropump for pumping the medication from the reservoir through the needle for delivering the medication to the patient, control circuitry controlling operations of the micropump, an interposer configured as an adapter for (1) mounting the reservoir, micropump, the control circuitry and the needle, and (2) distributing medication through one or more channels within the interposer from the reservoir to the needle via the micropump and electrical signals between the control circuitry and micropump.

Abstract: A device is disclosed that is configured as a fully autonomous and integrated wearable apparatus for diabetes management. The device comprise a self-pressurized reservoir for storing the medication for subsequent delivery to a patient, a needle for delivering the medication to the patient subcutaneously, a first MEMS device configured as a microvalve in a fluid path between the self-pressurized reservoir and needle for controlling flowrate of medication through the needle as the self-pressurized reservoir discharges, a second MEMS device configured as a micropump configured to increase flowrate of the medication in the fluid path to ensure a constant flowrate in the fluid path as the self-pressurized discharges independent of orientation of the device, a flow sensor configured to measure flowrate in the fluid path for controlling microvalve and micropump, and control circuitry connected to the microvalve, micropump and flow sensor for controlling operation of the micropump and microvalve.

Abstract: A method is disclosed of fabricating a MEMS device that includes one or more wafers configured as pump or valve. The pump or valve includes an inlet port to receive fluid and an outlet port to release the fluid within the pump or valve. The method comprises growing silicon dioxide on a silicon layer of the one or more wafers to form a silicon dioxide layer on the silicon layer, depositing silicon nitride on the silicon dioxide layer of the one or more wafers to form a silicon nitride layer on the silicon dioxide layer, spinning a front side to create a pattern thereon defining an area for the pump or valve, dry etching the one or more wafers at the area for the pump or valve to remove the silicon dioxide and silicon nitride layers to define an opening for the pump or valve.

Abstract: A device for delivering a medication to a patient in a drug infusion system is disclosed. The device is configured as a fully autonomous and integrated wearable apparatus for managing the medication delivery. The device comprises: a reservoir for storing the medication to be delivered to the patient; a continuous glucose monitoring device for monitoring glucose levels in the patient to set flow rates for medication delivery; a needle for delivering the medication from reservoir into the patient; and a pumping unit including one or more MEMS devices configured to function as (a) a pump for pumping the medication from the reservoir through a flow path for medication to the needle at set flow rates and/or (b) a valve for regulating flow of the medication in the flow path from the reservoir through the needle.

Abstract: A method for managing delivery of medication to a patient including medication dosage control and medication flow rate control for the patient. The method comprises controlling flow rate of the medication to be delivered to the patient through a needle that is subcutaneously inserted into the patient including: monitoring glucose levels in the patient using a continuous glucose monitoring device; converting the glucose levels from the continuous glucose monitoring device into instructions by control algorithms within a microcontroller unit; commanding a pumping unit to deliver the medication through the needle at a flow rate based on the converted instructions; and delivering the medication through the needle into the patient at the flow rate; and adjusting the flow rate continually to reduce a difference between actual flow rate measured off of the pumping unit and a converted flow rate from the continuous glucose monitoring device.

Abstract: Described examples include devices and methods for measuring relative humidity of an environment using inductance. The devices can include a resonant circuit, including a capacitor and an inductor. The inductor includes a moisture-absorbing core with at least a portion thereof exposed to an environment, with at least one magnetic property of the core being variable in response to changing levels of moisture in the environment. An excitation circuit provides an AC excitation signal to the resonant circuit. A sense circuit determines an inductance of the inductor according to a sense signal from the resonant circuit. The sense circuit is coupled to generate an output signal that indicates a humidity level of the environment according to the sense signal.

Abstract: A resonator includes a substrate, an acoustic Bragg mirror disposed above the substrate, and a bottom metal layer disposed above the acoustic Bragg mirror. The resonator also includes a piezoelectric plate disposed above the bottom metal layer. The resonator further includes a top metal layer disposed above the piezoelectric plate. The top metal layer comprises multiple fingers within a single plane and the width of each of the fingers is between 75%-125% of a thickness of the piezoelectric plate.

Abstract: In described examples of an integrated circuit (IC) there is a substrate of semiconductor material having a first region with a first transistor formed therein and a second region with a second transistor formed therein. An isolation trench extends through the substrate and separates the first region of the substrate from the second region of the substrate. An interconnect region having layers of dielectric is disposed on a top surface of the substrate. A dielectric polymer is disposed in the isolation trench and in a layer over the backside surface of the substrate. An edge of the polymer layer is separated from the perimeter edge of the substrate by a space.

Abstract: Semiconductor devices and methods and apparatus to produce such semiconductor devices are disclosed. An integrated circuit package includes a lead frame including a die attach pad and a plurality of leads; a die including a MEMs region defined by a plurality of trenches, the die electrically connected to the plurality of leads; and a mold compound covering portions of the die, the mold compound defining a cavity between a surface of the die and a surface of the mold compound, wherein the mold compound defines a vent.

Abstract: A MEMS resonator is operated at its parallel resonance frequency. An acoustic wave is propagated laterally away from a central region of the MEMS resonator through a piezoelectric layer of the MEMS resonator. The propagating acoustic wave is attenuated with concentric confiners that surround and are spaced apart from a perimeter of an electrode that forms the MEMS resonator.

Abstract: In described examples of an integrated circuit (IC) there is a substrate of semiconductor material having a first region with a first transistor formed therein and a second region with a second transistor formed therein. An isolation trench extends through the substrate and separates the first region of the substrate from the second region of the substrate. An interconnect region having layers of dielectric is disposed on a top surface of the substrate. A dielectric polymer is disposed in the isolation trench and in a layer over the backside surface of the substrate. An edge of the polymer layer is separated from the perimeter edge of the substrate by a space.

Abstract: A micromechanical system (MEMS) resonator includes a base substrate. A piezoelectric layer has a first electrode attached to a first surface of the piezoelectric layer and a second electrode attached to a second surface of the piezoelectric layer opposite the first electrode. The first electrode is bounded by a perimeter edge. A patterned acoustic mirror is formed on a top surface of the first electrode opposite the piezoelectric layer, such that the patterned acoustic mirror covers a border strip of the top surface of the first electrode at the perimeter edge and does not cover an active portion of the top surface of the first electrode.