Abstract: A microelectromechanical (MEMS) microphone includes a MEMS motor and a gain adjustment apparatus. The MEMS motor includes at least a diaphragm and a charge plate and is configured to receive sound energy and transform the sound energy into an electrical signal. The gain adjustment apparatus has an input and an output and is coupled to the MEMS motor. The gain adjustment apparatus is configured to receive the electrical signal from the MEMS motor at the input and adjust the gain of the electrical signal as measured from the output of the gain adjustment apparatus. The amount of gain is selected so as to obtain a favorable sensitivity for the microphone.

Abstract: A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.

Abstract: A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.

Abstract: The claim invention is directed at a MEMS microphone die fabricated using CMOS-based technologies. In particular, the claims are directed at various aspects of a diaphragm for a MEMS microphone die which is fabricated as stacked metallic layers separated by vias using CMOS fabrication technologies.

Abstract: The claim invention is directed at a MEMS microphone die fabricated using CMOS-based technologies. In particular, the claims are directed at various aspects of a MEMS microphone die having anisotropic springs, a backplate, a diaphragm, mechanical stops, and a support structure, all of which are fabricated as stacked metallic layers separated by vias using CMOS fabrication technologies.

Abstract: A tool includes a collet, a vacuum path, and a top die. The collet has a first end and a second end. The second end is configured so as to be coupled to an air suction device. The vacuum path is formed inside and along a length of the collet and extends from the first end to the second end of the collet. The top die is coupled to the first end of the collet. The top die includes a plurality of raised islands, and each of the plurality of raised islands including a hole. The hole communicates with the vacuum path such that a suction applied by the suction device draws air through the hole and then through the vacuum path and is sufficient to pick up a MEMS component disposed in proximity to the hole.

Abstract: A micro-electro-mechanical system (MEMS) microphone includes a rectangular substrate with a rigid base layer, a first metal layer, a second metal layer, one or more electrical pathways, an acoustic port, and a patterned flexible printed circuit board material. The MEMS microphone also includes a MEMS microphone die and a solid single-piece rectangular cover.

Abstract: The claim invention is directed at a MEMS microphone die fabricated using CMOS-based technologies. In particular, the claims are directed at various aspects of a MEMS microphone die having anisotropic springs, a backplate, a diaphragm, mechanical stops, and a support structure, all of which are fabricated as stacked metallic layers separated by vias using CMOS fabrication technologies.

Abstract: A human interface device is provided, having a substrate. A strain sensitive die is coupled to the substrate wherein the die is capable of providing an electrical signal indicative of a force applied to the strain sensitive die. A force transfer element is positioned adjacent to the strain sensitive die and coupled to the strain sensitive die. A translation element is mechanically coupled to the force transfer element. An elastic element is at least partially surrounding the translation element and the force transfer element, wherein the elastic element provides the mechanical coupling between the translation element and the force transfer element. A force applied to the translation element causes stretching of the elastic element, wherein the stretching of the elastic element causes a force to be applied to the force transfer element; and wherein the force applied to the force transfer element by the elastic element is then applied to the strain sensitive die.

Abstract: A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.

Abstract: A plurality of MEMS transducer packages is manufactured by placement of a plurality of transducers onto a panel of undivided package substrates, attachment of a plurality of individual covers onto a panel and over the transducers, depositing an epoxy into the channels between the covers, and then singulating the panel into individual MEMS transducer packages.

Abstract: A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.

Abstract: A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.

Abstract: An interface is provided between a transducer and audio processing circuitry. The interface has a switching device coupled to the transducer. The interface also has a first signal path that is selectively coupled to transducer via the switching device and includes a first output, the first signal path being configured to selectively receive input signals from the transducer, and form a first output signal at the first output by amplifying the input signals to provide a first gain. The first output is coupled to the audio processing circuitry. A second signal path is provided that is selectively coupled to the transducer via the switching device and includes a second output. The second gain is selected to be substantially larger than the first gain. The switching device is configured to switch the input signal between the first signal path and the second signal path.

Abstract: A microphone assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, an acoustic transducer acoustically sealed to the lid, and an interposer. The interposer and the acoustic transducer are electrically connected without using the lid as an electrical conduit. The transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal.

Abstract: A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.

Abstract: An acoustic microphone includes a back plate, a diaphragm, and a microelectromechanical system (MEMS) structure that is coupled to the back plate and the diaphragm. The MEMS structure is disposed on a substrate. The back plate includes a first layer and a second layer that are disposed in generally parallel relation to each other. The first layer including a first opening with a first sizing and the second layer including a second opening with a second sizing. The first sizing is different from the second sizing. The first opening and the second opening form a channel through the back plate.

Abstract: A microphone is provided. The microphone has a housing; an acoustic port located in the housing; a substrate coupled with the housing; an integrated circuit positioned onto the substrate; and two or more MEMS transducers mounted on the substrate wherein the transducers are connected in parallel.

Abstract: A microelectromechanical (MEMS) microphone includes a MEMS motor and a gain adjustment apparatus. The MEMS motor includes at least a diaphragm and a charge plate and is configured to receive sound energy and transform the sound energy into an electrical signal. The gain adjustment apparatus has an input and an output and is coupled to the MEMS motor. The gain adjustment apparatus is configured to receive the electrical signal from the MEMS motor at the input and adjust the gain of the electrical signal as measured from the output of the gain adjustment apparatus. The amount of gain is selected so as to obtain a favorable sensitivity for the microphone.

Abstract: A microphone is provided. The microphone has a housing; an acoustic port located in the housing; a substrate coupled with the housing; an integrated circuit positioned onto the substrate; and two or more MEMS transducers mounted on the substrate wherein the transducers are connected in parallel.