Abstract: The present invention relates to the manufacture of radio-electronic equipment. The proposed apparatus for soldering a row of conductors onto a board comprises a housing having a table for a board to be arranged thereon, and a soldering head kinematically coupled to a carriage driven by a drive mechanism. The soldering head is kinematically coupled to the carriage by means of a rod adapted for movement in the carriage and having a holder, the soldering head being spring-loaded and arranged in the holder.

Abstract: An apparatus for soldering a plurality of flat conductors on a board consisting of a head with a soldering element and of a mechanism for relative displacement of the board and head. The soldering element has a working surface unwetted by the solder wherein, according to the invention, there is incorporated an elongated portion wetted by the solder and disposed at an angle to the line of relative displacement of the board and head. Said portion serves to spread the solder over each lead while being moved at a constant rate from lead to lead in succession.