Patents by Inventor Petrus Janssen

Petrus Janssen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing encapsulated electronic components, particularly integrated circuits
    Patent number: 6613607
    Abstract: A method for manufacturing encapsulated electronic components, particularly integrated circuits, is provided. The method includes the steps of: a) attaching electronic components on a first side of an electrically conducting support and electrically connecting the electronic components to the electrically conducting support; b) using a mold to encapsulate the electronic components with an encapsulating material on just the first side of the electrically conducting support, while a second side of the support is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, the individual encapsulated electronic components, wherein bonding of the adhesive film to a second side to be shielded of the electrically conducting support takes place between step a) and step b).
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: September 2, 2003
    Assignee: “3P” Licensing B.V.
    Inventors: Johannes Bernardus Petrus Janssen, Johannes Bernardus de Vrught
  • Method for manufacturing encapsulated electronic components, particularly integrated circuits
    Publication number: 20020064926
    Abstract: A method for manufacturing encapsulated electronic components, particularly integrated circuits, is provided. The method includes the steps of: a) attaching electronic components on a first side of an electrically conducting support and electrically connecting the electronic components to the electrically conducting support; b) using a mould to encapsulate the electronic components with an encapsulating material on just the first side of the electrically conducting support, while a second side of the support is substantially completely shielded with the aid of an adhesive film; and c) removing the adhesive film and separating, along cutting lines, the individual encapsulated electronic components, wherein bonding of the adhesive film to a second side to be shielded of the electrically conducting support takes place between step a) and step b).
    Type: Application
    Filed: October 29, 2001
    Publication date: May 30, 2002
    Applicant: "3P" Licensing B.V.
    Inventors: Johannes Bernardus Petrus Janssen, Johannes Bernardus de Vrught