Patents by Inventor Petrus Joannes Joseph Moeleker

Petrus Joannes Joseph Moeleker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for cooling electronic systems
    Patent number: 7848101
    Abstract: A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: December 7, 2010
    Assignee: General Electric Company
    Inventors: Subhrajit Dey, Petrus Joannes Joseph Moeleker, Chellappa Balan
  • Method for forming a composite structure of backing material for use in a transducer assembly
    Patent number: 7694406
    Abstract: A composite structure of a backing material with enhanced conductivity for use in a transducer is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged with a plurality of thermal conductive elements, wherein the plurality of thermal conductive elements are configured to transfer heat from a center of the transducer to a plurality of points on the composite structure of backing material.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: April 13, 2010
    Assignee: General Electric Company
    Inventors: Douglas Glenn Wildes, Charles Edward Baumgartner, Petrus Joannes Joseph Moeleker, Bruno Hans Haider
  • System and method for cooling electronic systems
    Patent number: 7345873
    Abstract: A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: March 18, 2008
    Assignee: General Electric Company
    Inventors: Subhrajit (nmn) Dey, Petrus Joannes Joseph Moeleker, Chellappa (nmn) Balan
  • Ultrasound transducer with enhanced thermal conductivity
    Patent number: 7105986
    Abstract: A composite structure of a backing material with enhanced conductivity for use in a transducer is presented. The composite structure includes a plurality of layers of backing material alternatingly arranged with a plurality of thermal conductive elements, wherein the plurality of thermal conductive elements are configured to transfer heat from a center of the transducer to a plurality of points on the composite structure of backing material.
    Type: Grant
    Filed: August 27, 2004
    Date of Patent: September 12, 2006
    Assignee: General Electric Company
    Inventors: Douglas Glenn Wildes, Charles Edward Baumgartner, Petrus Joannes Joseph Moeleker, Bruno Hans Haider