Patents by Inventor Phani Vamsi Krishna Anantharaju

Phani Vamsi Krishna Anantharaju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11654838
    Abstract: An interior trim for a passenger compartment of a vehicle includes a first carrier, which has an inner side, facing the passenger compartment, and an outer side, directed away from the passenger compartment. A heating element is arranged on the outer side. It is proposed to arrange a matrix and a filler in the first carrier. The filler has a thermal conductivity that is higher than that of the matrix so that heat generated by the heating element can be directed through the filler into the passenger compartment.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: May 23, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Andreas Bock, Robert Wagschal, Bernd Dienhart, Phani Vamsi Krishna Anantharaju, Thomas Keller, Maximilian Klein, Kilian Vas
  • Publication number: 20190283689
    Abstract: An interior trim for a passenger compartment of a vehicle includes a first carrier, which has an inner side, facing the passenger compartment, and an outer side, directed away from the passenger compartment. A heating element is arranged on the outer side. It is proposed to arrange a matrix and a filler in the first carrier. The filler has a thermal conductivity that is higher than that of the matrix so that heat generated by the heating element can be directed through the filler into the passenger compartment.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Inventors: Andreas Bock, Robert Wagschal, Bernd Dienhart, Phani Vamsi Krishna Anantharaju, Thomas Keller, Maximilian Klein, Kilian Vas
  • Publication number: 20190241132
    Abstract: A thermally insulating device for a vehicle includes at least a first molded component which is constructed at least partially in a planar manner. The first molded device is also shaped in such a manner that it surrounds a hollow space in an air-tight manner. The first molded component has at least a first outer side and at least a first inner side. The first inner side faces the hollow space, and the hollow space is evacuated.
    Type: Application
    Filed: February 6, 2019
    Publication date: August 8, 2019
    Inventors: Andreas Bock, Robert Wagschal, Thomas Keller, Phani Vamsi Krishna Anantharaju, Bernd Dienhart