Patents by Inventor Phanit Tameerug

Phanit Tameerug has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8678271
    Abstract: In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the slit solder layer to form the solder joint, wherein the at least one slit forms an outgas alley to prevent void formation in the solder joint. Where solder joint width is a concern, the present method includes applying external pressure concurrently with heating. The outgas alley is formed to provide a ready avenue of escape for flux gasses produced during formation of the solder joint.
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: March 25, 2014
    Assignee: GLOBALFOUNDRIES Inc.
    Inventor: Phanit Tameerug
  • Publication number: 20090001138
    Abstract: In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the slit solder layer to form the solder joint, wherein the at least one slit forms an outgas alley to prevent void formation in the solder joint. Where solder joint width is a concern, the present method includes applying external pressure concurrently with heating. The outgas alley is formed to provide a ready avenue of escape for flux gasses produced during formation of the solder joint.
    Type: Application
    Filed: June 26, 2007
    Publication date: January 1, 2009
    Inventor: Phanit Tameerug