Patents by Inventor Phil Wills

Phil Wills has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8278559
    Abstract: An assembly comprising a first printed circuit board, PCB, with a ball grid array, BGA, on its underside, a second PCB facing the first PCB and having at least one through-hole between its top and bottom surfaces, its top surface printed with a circuit pattern bonded to the BGA, a heat sink layer facing the bottom surface of the second PCB and having at least one thermally-conductive pin projecting normally into the through-hole or a respective one of the through-holes in the second PCB, and, for each pin, a thermally-conductive stud of the same cross-section as the pin, bonded to the BGA and disposed within the through-hole between the pin and the first PCB in thermal contact with the pin.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: October 2, 2012
    Assignee: Thales Holdings UK PLC
    Inventors: Emmanuel Loiselet, Phil Wills
  • Publication number: 20100000766
    Abstract: An assembly comprising a first printed circuit board, PCB, with a ball grid array, BGA, on its underside, a second PCB facing the first PCB and having at least one through-hole between its top and bottom surfaces, its top surface printed with a circuit pattern bonded to the BGA, a heat sink layer facing the bottom surface of the second PCB and having at least one thermally-conductive pin projecting normally into the through-hole or a respective one of the through-holes in the second PCB, and, for each pin, a thermally-conductive stud of the same cross-section as the pin, bonded to the BGA and disposed within the through-hole between the pin and the first PCB in thermal contact with the pin.
    Type: Application
    Filed: June 25, 2009
    Publication date: January 7, 2010
    Applicant: Thales Holdings UK PLC
    Inventors: Emmanuel Loiselet, Phil Wills
  • Patent number: D440309
    Type: Grant
    Filed: November 17, 1998
    Date of Patent: April 10, 2001
    Assignee: Biomedical Disposal, Inc.
    Inventors: Willis Whiteside, Phil Wills, Vlad Moise