Abstract: The invention relates to a receiver optical sub-assembly (ROSA) for use in a high-speed small-form factor transceiver. The ROSA, according to the present invention, includes a stacked chip design in which a semiconductor micro-bench, upon which the photodiode and trans-impedance amplifier are mounted, is disposed perpendicular to the direction that the light travels. A flexible electrical connector is attached to the semiconductor micro-bench for electrically connecting the ROSA to a host transceiver device. The flexible electrical connector is fixed to the surface of the semiconductor micro-bench with portions cut-out to receive the amplifier and other electrical components extending therefrom. To facilitate assembly, wells are etched from the semiconductor micro-bench corresponding to bumps extending from a mounting flange for the optical coupler.

Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of asymmetric solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. This causes the chip to tilt to one side about the axis defined by the asymmetric pads.

Abstract: A microelectromechanical system (MEMS) tunable capacitor having low loss and a corresponding high Q is provided. The tunable capacitor includes a first substrate having a first capacitor plate disposed thereon. A fixed pivot structure is disposed on the first surface of the first substrate, proximate the first capacitor plate. The fixed pivot structure as a point of attachment for a flexible membrane that extends outward from the fixed pivot and generally overlies the first capacitor plate. A second substrate is attached to the underside of the flexible membrane and a second capacitor plate is disposed thereon such that the first and second capacitor plates face one another in a spaced apart relationship. A MEMS actuator is operably in contact with the flexible membrane for the purpose of providing an actuation force to the flexible membrane, thereby varying the capacitance between the first and second capacitor plates.

Abstract: A reflector having a mechanically deformable portion of at least one reflective surface is disclosed. By deforming the portion of the reflective surface, discontinuity is introduced in that portion of the reflective surface. The discontinuity in the reflective surface scatters incident radiation signals so as to cause attenuation in the reflected signal. By selectively deforming the portion of the reflective surface, the reflected signal can be modulated to encode data thereon. The mechanically deformable portion of the reflective surface preferably comprises plates integrally formed therein.

Abstract: A reflector having a mechanically deformable portion of at least one reflective surface is disclosed. By deforming the portion of the reflective surface, discontinuity is introduced in that portion of the reflective surface. The discontinuity in the reflective surface scatters incident radiation signals so as to cause attenuation in the reflected signal. By selectively deforming the portion of the reflective surface, the reflected signal can be modulated to encode data thereon. The mechanically deformable portion of the reflective surface preferably comprises plates integrally formed therein.

Abstract: Microelectronic packages are formed wherein solder bumps on one or more substrates are expanded, to thereby extend and contact the second substrate and form a solder connection. The solder bumps are preferably expanded by reflowing additional solder into the plurality of solder bumps. The additional solder may be reflowed from an elongated, narrow solder-containing region adjacent the solder bump, into the solder bump. After reflow, the solder bump which extends across a pair of adjacent substrates forms an arched solder column or partial ring of solder between the two substrates.

Abstract: Microelectronic packages are formed wherein solder bumps on one or more substrates are expanded, to thereby extend and contact the second substrate and form a solder connection. The solder bumps are preferably expanded by reflowing additional solder into the plurality of solder bumps. The additional solder may be reflowed from an elongated, narrow solder-containing region adjacent the solder bump, into the solder bump. After reflow, the solder bump which extends across a pair of adjacent substrates forms an arched solder column or partial ring of solder between the two substrates.

Abstract: Apparatus for shaping sheet material such as metal foil includes co-operating rollers with teeth, between which the sheet material is fed. The teeth shape the sheet to form corrugations, and projections on the flanks of the teeth form patterns on the corrugations. In order to free the shaped sheet from the teeth, resilient material projects from the flanks of the teeth and urges the sheet away from the flanks after a shaping operation.The invention is intended for use in forming the secondary heat exchange surfaces in aluminium radiators.