Patents by Inventor Philip Andrew Swire

Philip Andrew Swire has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming board assembly with chemical vapor deposition diamond (CVDD) windows for thermal transport
    Patent number: 11538732
    Abstract: A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: December 27, 2022
    Assignee: MICROCHIP TECHNOLOGY CALDICOT LIMITED
    Inventors: Philip Andrew Swire, Nina Biddle
  • Chemical vapor deposition diamond (CVDD) wires for thermal transport
    Patent number: 11488888
    Abstract: A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: November 1, 2022
    Assignee: MICROCHIP TECHNOLOGY CALDICOT LIMITED
    Inventors: Philip Andrew Swire, Nina Biddle
  • Method for forming Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Windows for Thermal Transport
    Publication number: 20220028753
    Abstract: A method for forming a board assembly includes identifying a location of a hot-spot on a semiconductor die and cutting an opening in a circuit board corresponding to the location of the identified hot-spot. A Chemical Vapor Deposition Diamond (CVDD) window is inserted into the opening. A layer of thermally conductive paste is applied over the CVDD window. The semiconductor die is placed over the layer of thermally conductive paste such that the CVDD window underlies the hot-spot and such that a surface of the semiconductor die is in direct contact with the layer of thermally conductive paste.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Applicant: Microchip Technology Caldicot Limited
    Inventors: Philip Andrew Swire, Nina Biddle
  • Board assembly with chemical vapor deposition diamond (CVDD) windows for thermal transport
    Patent number: 11189543
    Abstract: A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a first circuit board having an opening extending through the first circuit board. A Chemical Vapor Deposition Diamond (CVDD) window extends within the opening. A layer of thermally conductive paste extends over the CVDD window. A semiconductor die extends over the layer of thermally conductive paste such that a hot-spot on the semiconductor die overlies the CVDD window.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: November 30, 2021
    Assignee: Microchip Technology Caldicot Limited
    Inventors: Philip Andrew Swire, Nina Biddle
  • Chemical Vapor Deposition Diamond (CVDD) Wires for Thermal Transport
    Publication number: 20210143080
    Abstract: A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.
    Type: Application
    Filed: December 24, 2019
    Publication date: May 13, 2021
    Applicant: Microsemi Semiconductor Limited
    Inventors: Philip Andrew Swire, Nina Biddle
  • Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Windows for Thermal Transport
    Publication number: 20210035883
    Abstract: A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a first circuit board having an opening extending through the first circuit board. A Chemical Vapor Deposition Diamond (CVDD) window extends within the opening. A layer of thermally conductive paste extends over the CVDD window. A semiconductor die extends over the layer of thermally conductive paste such that a hot-spot on the semiconductor die overlies the CVDD window.
    Type: Application
    Filed: September 12, 2019
    Publication date: February 4, 2021
    Applicant: Microsemi Semiconductor Limited
    Inventors: Philip Andrew Swire, Nina Biddle