Patents by Inventor Philip Andrew Vernon

Philip Andrew Vernon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11643821
    Abstract: The invention concerns a mounting system to support free-form architectural panels, in particular molded panels made from fiber composite materials such as concrete, resin, and gypsum. The mounting system comprises a socket which can be securely embedded in the panel during casting. The mounting system further comprises a ball joint which is clamped into the socket and allows for attachment of the panel to support structure.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: May 9, 2023
    Assignee: DIGITAL ENVIRONMENT CONSTRUCTION, LLC
    Inventor: Philip Andrew Vernon
  • Publication number: 20210293031
    Abstract: The invention concerns a mounting system to support free-form architectural panels, in particular molded panels made from fiber composite materials such as concrete, resin, and gypsum. The mounting system comprises a socket which can be securely embedded in the panel during casting. The mounting system further comprises a ball joint which is clamped into the socket and allows for attachment of the panel to support structure.
    Type: Application
    Filed: March 23, 2021
    Publication date: September 23, 2021
    Applicant: EVERGROW INTERNATIONAL TRADING (SHANGHAI) CO., LTD.
    Inventor: Philip Andrew Vernon