Patents by Inventor Philip B. Snow

Philip B. Snow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Suppression of radiated harmonics
    Patent number: 4739286
    Abstract: Suppression of radiated harmonics in a single stage transistor oscillator and transmitter circuit is achieved by inserting a narrow band filter, such as a surface acoustic wave resonator (SAWR), in the oscillator signal feedback loop at the point of emissions of the harmonics.
    Type: Grant
    Filed: October 23, 1986
    Date of Patent: April 19, 1988
    Assignee: Tektronix, Inc.
    Inventors: Philip B. Snow, Emmanuel Sang
  • Low parasitic shunt diode package
    Patent number: 4246556
    Abstract: A removable diode package for mounting beam-lead diodes in coaxial, stripline or waveguide microwave circuits is described. The diode package is capable of operation at frequencies above 40 GHz. A low-dielectric polyimide insulating washer is used to reduce parasitic elements normally associated with diode packages at microwave and millimeter frequencies.
    Type: Grant
    Filed: March 9, 1979
    Date of Patent: January 20, 1981
    Assignee: Tektronix, Inc.
    Inventor: Philip B. Snow
  • Amplitude weighted surface acoustic wave device
    Patent number: 4134087
    Abstract: A surface acoustic wave device embodying a novel technique of weighting the tapping amplitude of an interdigital surface acoustic wave transducer, the amplitude weights being implemented by means of planar resistors deposited so that one is connected in series with each sampling electrode of the interdigital transducer.
    Type: Grant
    Filed: April 8, 1977
    Date of Patent: January 9, 1979
    Assignee: Hughes Aircraft Company
    Inventors: Henry M. Gerard, Philip B. Snow
  • Modular mounting apparatus for substrate means bearing planar circuit means
    Patent number: 4129897
    Abstract: A modular mounting apparatus for substrate means bearing planar circuit means is provided and includes a design of components that assemble into a housing package for microcircuit modules with means for locating, supporting, interconnecting and housing them; in an interference free environment, i.e., provisions for moisture, radio frequency interference and electromagnetic interference sealing are provided. The apparatus provides a modular systematic and economical means of packaging for low frequency printed circuit boards to microwave frequency microcircuits.
    Type: Grant
    Filed: January 18, 1978
    Date of Patent: December 12, 1978
    Assignee: Tektronix, Inc.
    Inventors: Fred J. Telewski, Carlos L. Beeck, Philip B. Snow