Abstract: Multilayer radiation curable liquid coating compositions are provided that include one or more UV oligomers including at least one aliphatic urethane acrylic oligomer; at least one acrylate diluent monomer selected from a mono-, bi-, and tri-functional reactive acrylate diluent monomers; at least one photo-initiator; at least one UV absorber; at least one hindered amine light stabilizer; and at least one antioxidant, where the liquid composition does not comprise a solvent and does not comprise an adhesion promoter. The UV oligomer in the base coat composition has elongation higher than 200% and tensile strength lower than 1000 psi. The UV oligomer in the top coat composition has tensile strength higher than 5000 psi. A coating system is provided that includes a liquid primer coat composition, a liquid base coat composition and a liquid top coat composition.

Abstract: Multilayer radiation curable liquid coating compositions are provided that include one or more UV oligomers including at least one aliphatic urethane acrylic oligomer; at least one acrylate diluent monomer selected from a mono-, bi-, and tri-functional reactive acrylate diluent monomers; at least one photo-initiator; at least one UV absorber; at least one hindered amine light stabilizer; and at least one antioxidant, where the liquid composition does not comprise a solvent and does not comprise an adhesion promoter. The UV oligomer in the base coat composition has elongation higher than 200% and tensile strength lower than 1000 psi. The UV oligomer in the top coat composition has tensile strength higher than 5000 psi. A coating system is provided that includes a liquid primer coat composition, a liquid base coat composition and a liquid top coat composition.

Abstract: A multilayer conformal coating is optimized in both composition and geometry to protect the back and sides of a transparent-fronted thin-film solar photovoltaic panel or similar device from various damage mechanisms associated with long-term outdoor exposure without an additional backcap or edge frame. A “barrier stack” or “barrier layer” of inorganic moisture-barrier and chemical-barrier layers is applied to the back of the photovoltaic functional film stack, extending into a bare-substrate border zone around the functional stack edges. The barrier stack shields the functional stack from moisture and chemical invasion, and the coated border zone effectively seals the vulnerable edges of the functional stack. An “envelope stack” or “envelope layer” of thicker polymer films is applied over the mechanically delicate inorganic barrier stack and around the solar photovoltaic panel edges.

Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.