Abstract: The present invention provides a liquid epoxy resin composition that includes an epoxy resin, at least one filler and an inorganic thixotropic agent in an amount effective to reduce settling of said filler at ambient temperatures. The composition further includes a polymer powder that dissolves in and thickens the composition when the composition is heated. The polymer powder is added in an amount effective to reduce settling of said filler at temperatures up to the gelling temperature of the composition. The thixotropic agent is added in an amount that the resulting epoxy resin composition is a free-flowing liquid. The composition may optionally further include a curing agent.

Abstract: The present invention provides a process for the manufacture of a moulded article which comprises introducing a curable epoxy resin composition to a mould which is at a temperature high enough to initiate curing of the resin and supplying further resin under pressure to compensate for shrinkage of the composition, the epoxy resin containing coarse decorative particles therein, wherein the epoxy resin is introduced into the mould through a gap having a length which is 30 to 100% of that dimension of the moulded product being made which is adjacent to the gap and a width which is at least twice the maximum size of the decorative particles.

Abstract: A process for making a cured plastics moulding by introducing a pre-heated curable resin composition to a hotter mould which is at a temperature high enough to initiate curing of the resin, and supplying further resin under pressure to compensate for shrinkage of the composition wherein the curable resin is a formulation comprising an aromatic glycidyl ether epoxy resin, an inert filler, a quaternary ammonium or phosphonium salt as accelerator, 0.5-1.2 mol per mol epoxy of a saturated cycloaliphatic anhydride and a polycarboxylic acid preferably derived from the reaction of a polyol, this acid being present at a level of 0.05-0.5 mol carboxyl per mol epoxy.