Abstract: The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.