Abstract: A cannula assembly includes a tubular element forming a lumen, a deployable portion of the tubular element, and an electronic component mounted to the deployable portion of the tubular element. The tubular element has a proximal end and a distal end adapted to be inserted into a body cavity. The deployable portion of the tubular element is engaged near the distal end of the tubular element so as to transition between a closed position and an open position. The electronic component is at least partially disposed in the lumen when the deployable portion is in the closed position.

Abstract: An optical apparatus relates to the field of optical magnification and stereoscopy, more specifically to the problem of optically magnifying an area stereoscopically and displaying this information to an operator in a comfortable manner.

Abstract: A cannula assembly includes a tubular element forming a lumen, a deployable portion of the tubular element, and an electronic component mounted to the deployable portion of the tubular element. The tubular element has a proximal end and a distal end adapted to be inserted into a body cavity. The deployable portion of the tubular element is engaged near the distal end of the tubular element so as to transition between a closed position and an open position. The electronic component is at least partially disposed in the lumen when the deployable portion is in the closed position.

Abstract: A hand-held imager which is capable of reading both linear and two dimensional symbologies, which can perform focusing and illuminating steps quickly and accurately so as to eliminate variation in the position of the imager relative to the code becoming a negative factor, in which can operate in environment where the imager is anywhere from 1.5 inches to 16 inches from the code. The imager includes an imaging system having a focusing system, an illumination system, and a two-dimensional photodetector which forms an image of the coded symbology. After achieving targeting of the coded symbology, the scanning system adjusts the focus between multiple different focuses, and utilizes a portion of the two-dimensional photodetector to determine the optimum focus. Upon the determination of optimum focus, the focusing system is returned to the focusing configuration established in the initial focusing step, and an image is created using the entire two-dimensional photodetector.

Abstract: Diffuse “dark field” illumination and “bright field” illumination are each provided for a hand-held encoded symbology imager/reader; to be projected therefrom upon symbology disposed on a target (component part, goods, package, etc.). The imager/reader is encased in a housing ergonomically configured to be griped in more then one manner and to thus facilitate holding the imager/reader steady. The symbology to be imaged is targeted by a line that not only spots the symbology, but by extending a length commensurate with that of the symbology, indicates that the symbology is in the field of view of the imager/reader. A CCD, disposed to receive light reflected from the symbology, has its readout controlled so that only selected portions of the CCD need be analyzed for illumination and focusing purposes.

Abstract: Cooperative patterns are formed in stencils and/or substrates that facilitate the monitoring and control of the circuit assembly process. A pattern of successively-larger etch blocks receives a corresponding pattern of same-size solder blocks; solder reflow problems are indicated when either too many or too few etch blocks are completely covered by solder after reflow. A pattern of same-size etch blocks receives a corresponding pattern of successively-larger solder blocks; problems with solder stencil clogging are indicated when smaller ones of the etch blocks do not receive solder paste during stenciling. Finally, component beacon openings or translucent areas are made in the electronics assembly at component locations. After component placement, the board is appropriately lit, and any uncovered openings indicate missing or grossly misaligned components.

Abstract: Etch features are included on a printed circuit (PC) board to be used in monitoring and controlling assembly processes such as soldering. A vernier pattern of etch blocks receives corresponding solder blocks during solder paste screening; misalignment of the solder stencil to the PC board is indicated by an easily-seen interference pattern of spaces created by the superimposed etch and solder blocks. The degree of misalignment can be determined by measuring the distance between the center of the interference pattern and a reference etch block. Also, a scale pattern of etch receives a bar of solder paste; misalignment in the direction orthogonal to the long axis of the scale is indicated by the location of the intersection of the long axis and the solder bar.