Patents by Inventor Philip Eugene Rogren

Philip Eugene Rogren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical system with lighting configuration and method of manufacture thereof
    Patent number: 10612751
    Abstract: An electrical system includes: a first base structure; a second base structure spaced apart from and opposing the first base structure; a lens unit including a first end portion attached to the first base structure and a second end portion attached to the second base structure; a first light source attached to the first base structure and enclosed within the lens unit; and a second light source attached to the second base structure and enclosed within the lens unit.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: April 7, 2020
    Assignee: EOPLEX, LIMITED
    Inventors: Alex Shaikevitch, Sam Mahin Shirazi, Philip Eugene Rogren
  • INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20180374809
    Abstract: A method of manufacture of an integrated circuit system includes: providing a semiconductor wafer with a bond pad; attaching a detachable carrier to the semiconductor wafer, the detachable carrier including a carrier frame portion and a terminal structure; removing the carrier frame portion with the terminal structure attached to the semiconductor wafer; and forming an encapsulation encapsulating the semiconductor wafer, the bond pad, and the terminal structure.
    Type: Application
    Filed: August 30, 2018
    Publication date: December 27, 2018
    Inventors: David G. Love, Philip Eugene Rogren
  • INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20160190078
    Abstract: A method of manufacture of an integrated circuit system includes: providing a semiconductor wafer with a bond pad; attaching a detachable carrier to the semiconductor wafer, the detachable carrier including a carrier frame portion and a terminal structure; removing the carrier frame portion with the terminal structure attached to the semiconductor wafer; and forming an encapsulation encapsulating the semiconductor wafer, the bond pad, and the terminal structure.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 30, 2016
    Inventors: David G. Love, Philip Eugene Rogren
  • ELECTRICAL SYSTEM WITH LIGHTING CONFIGURATION AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20160138781
    Abstract: An electrical system includes: a first base structure; a second base structure spaced apart from and opposing the first base structure; a lens unit including a first end portion attached to the first base structure and a second end portion attached to the second base structure; a first light source attached to the first base structure and enclosed within the lens unit; and a second light source attached to the second base structure and enclosed within the lens unit.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 19, 2016
    Inventors: Alex Shaikevitch, Sam Mahin Shirazi, Philip Eugene Rogren