Patents by Inventor Philip H. Chen
Philip H. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7833879Abstract: A spatial light modulator is fabricated by bonding a capping layer over a wafer bearing active reflecting surfaces utilizing a low temperature bonding agent capable of providing a hermetic seal, such as a glass frit. The low temperature bonding agent may be B-stage cured after application to the capping layer, prior to any exposure to the substrate bearing the reflecting surfaces. In accordance with one embodiment of the present invention, the capping layer may comprise a glass wafer pre-bonded with an interposer spacer layer to provide sufficient stand-off between the capping layer and the underlying reflecting structures. In accordance with an alternative embodiment of the present invention, the capping layer may comprise a glass wafer alone, and the bonding agent may include additional materials such as beads or balls to provide the necessary stand-off between the capping layer and the underlying reflective structures.Type: GrantFiled: May 7, 2009Date of Patent: November 16, 2010Assignee: Miradia Inc.Inventor: Philip H. Chen
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Publication number: 20090275170Abstract: A spatial light modulator is fabricated by bonding a capping layer over a wafer bearing active reflecting surfaces utilizing a low temperature bonding agent capable of providing a hermetic seal, such as a glass frit. The low temperature bonding agent may be B-stage cured after application to the capping layer, prior to any exposure to the substrate bearing the reflecting surfaces. In accordance with one embodiment of the present invention, the capping layer may comprise a glass wafer pre-bonded with an interposer spacer layer to provide sufficient stand-off between the capping layer and the underlying reflecting structures. In accordance with an alternative embodiment of the present invention, the capping layer may comprise a glass wafer alone, and the bonding agent may include additional materials such as beads or balls to provide the necessary stand-off between the capping layer and the underlying reflective structures.Type: ApplicationFiled: May 7, 2009Publication date: November 5, 2009Applicant: Miradia Inc.Inventor: Philip H. Chen
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Patent number: 7585747Abstract: A spatial light modulator is fabricated by bonding a capping layer over a wafer bearing active reflecting surfaces utilizing a low temperature bonding agent capable of providing a hermetic seal, such as a glass frit. The low temperature bonding agent may be B-stage cured after application to the capping layer, prior to any exposure to the substrate bearing the reflecting surfaces. In accordance with one embodiment of the present invention, the capping layer may comprise a glass wafer pre-bonded with an interposer spacer layer to provide sufficient stand-off between the capping layer and the underlying reflecting structures. In accordance with an alternative embodiment of the present invention, the capping layer may comprise a glass wafer alone, and the bonding agent may include additional materials such as beads or balls to provide the necessary stand-off between the capping layer and the underlying reflective structures.Type: GrantFiled: July 22, 2005Date of Patent: September 8, 2009Assignee: Miradia Inc.Inventor: Philip H. Chen
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Patent number: 6426880Abstract: Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an, electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or “dam” over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packing density of devices on the circuit board.Type: GrantFiled: March 3, 2000Date of Patent: July 30, 2002Assignee: Intermedics, Inc.Inventor: Philip H. Chen
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Patent number: 6406940Abstract: Disclosed is a method for stacking semiconductor chips, including positioning a first chip and manipulating a second chip to a distance above the first chip that is no greater than a selected distance, and releasing the second chip to drop into a stacked configuration on the first chip. The selected distance is such as to avoid damage to either of the chips. Embodiments are disclosed for setting the drop distance of the second chip within the selected distance.Type: GrantFiled: August 14, 2000Date of Patent: June 18, 2002Assignee: Intermedics Inc.Inventor: Philip H. Chen
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Patent number: 6251219Abstract: A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an electronic device. An adhesive applying device, such as a screen printer, applies adhesive to the backside of each circuit component. The circuit components may then be transferred onto a substrate by the use of a piston transfer device, for instance. Preferably, all the circuit components are transferred substantially simultaneously.Type: GrantFiled: September 17, 1998Date of Patent: June 26, 2001Assignee: Intermedics Inc.Inventors: Philip H. Chen, Dennis M. Gibson, Cuong Van Pham
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Patent number: 6246587Abstract: Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or “dam” over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packing density of devices on the circuit board.Type: GrantFiled: December 3, 1998Date of Patent: June 12, 2001Assignee: Intermedics Inc.Inventor: Philip H. Chen
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Patent number: 6182357Abstract: A manufacturing method and apparatus for dicing printed circuit boards is disclosed that permits PCB's to be manufactured with greater component density and cut less expensively. The disclosed method includes forming a raw substrate to include conductive traces, mounting components on the substrate, testing the PCB and then cutting off the waste edges. The PCB can be formed and tested with components mounted on one or both sides of the PCB, and the waste edges can be cut off even with components mounted on both sides of the board. A workpiece fixture is provided that includes a recessed cavity into which PCB components extend. Double-sided boards can be cut using the disclosed workpiece fixture. The cavity includes a vacuum hole through which suction is provided to hold the PCB in place during cutting. Additional vacuum holes preferably are provided to hold the wings in place after they are removed.Type: GrantFiled: January 5, 1999Date of Patent: February 6, 2001Assignee: Intermedics Inc.Inventors: Philip H. Chen, John C. Munson, Timothy M. Gadd
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Patent number: 5987358Abstract: A sub-assembly module for surface mounting on an implantable medical device hybrid module is provided. The sub-assembly module includes one or more electronic components mounted on a substrate. Interconnection between the electronic components and the hybrid module is established by bond pads on the upper and lower surfaces of the substrate and thru-substrate conducting plugs connecting respective upper and lower bond pads. The electronic components are encapsulated in a layer of insulating material. The electronic components may be chip-and-wire mounted to the sub-assembly module and the sub-assembly module may, in turn, be surface mounted to the hybrid module, permitting the integration of chip-and-wire and surface mount processing for a given hybrid module.Type: GrantFiled: February 17, 1998Date of Patent: November 16, 1999Assignee: Intermedics, Inc.Inventors: Thomas G. Sosebee, Philip H. Chen, Dennis Gibson, Kenneth R. Ulmer
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Patent number: 5963429Abstract: A printed circuit board substrate includes cavities in which electronic components, such as integrated circuits, are mounted and encapsulated. Once the electronic components are encapsulated, other electronic components can be mounted above the encapsulated component on the top surface of the substrate, thereby increasing the number of components that can be mounted to a circuit board of a given area. The encapsulated components are mounted using any one of a variety of techniques. The substrate may include multiple conductive layers for electrically interconnecting the encapsulated components to other components.Type: GrantFiled: August 20, 1997Date of Patent: October 5, 1999Assignee: Sulzer Intermedics Inc.Inventor: Philip H. Chen