Patents by Inventor Philip John King

Philip John King has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for testing of bonds of a semiconductor assembly
    Patent number: 8844368
    Abstract: An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe including a straight, thermally conductive pin; a heater for heating a tip of the probe; a holder for supporting the probe and including a clamping mechanism that is configured to provide a clamping force on the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond.
    Type: Grant
    Filed: April 25, 2011
    Date of Patent: September 30, 2014
    Assignee: Nordson Corporation
    Inventors: Benjamin K. Peecock, Philip John King
  • SYSTEM AND METHOD FOR TESTING OF BONDS OF A SEMICONDUCTOR ASSEMBLY
    Publication number: 20110277556
    Abstract: An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe including a straight, thermally conductive pin; a heater for heating a tip of the probe; a holder for supporting the probe and including a clamping mechanism that is configured to provide a clamping force on the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond.
    Type: Application
    Filed: April 25, 2011
    Publication date: November 17, 2011
    Applicant: NORDSON CORPORATION
    Inventors: Benjamin K. Peecock, Philip John King
  • SYSTEM AND METHOD FOR TESTING OF BONDS OF A SEMICONDUCTOR ASSEMBLY
    Publication number: 20110277555
    Abstract: An apparatus applies a pull test to a bond of a semi-conductor assembly, the bond including a ball or a bump of solder. The apparatus includes a probe having a longitudinal axis; a heater for heating a tip of the probe; a holder for supporting the probe; an actuation device for moving the holder and the probe up and down; and a pull force applier for applying a pull force on the holder along the longitudinal axis of the probe. A force measuring system measures a force applied to the probe during the pull test to determine the strength of the bond.
    Type: Application
    Filed: April 25, 2011
    Publication date: November 17, 2011
    Applicant: NORDSON CORPORATION
    Inventors: Benjamin K. Peecock, Philip John King