Patents by Inventor Philip Lyndon Cablao

Philip Lyndon Cablao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation
    Patent number: 8569872
    Abstract: An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: October 29, 2013
    Assignee: STATS ChipPAC Ltd.
    Inventors: Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho, Philip Lyndon Cablao, Jose Alvin Caparas
  • Integrated circuit heat spreader stacking system
    Patent number: 8421221
    Abstract: An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: April 16, 2013
    Assignee: STATS ChipPAC Ltd.
    Inventors: Dario S. Filoteo, Jr., Emmanuel Espiritu, Philip Lyndon Cablao
  • Integrated circuit package system with heatspreader
    Patent number: 8395254
    Abstract: An integrated circuit package system includes providing a substrate having an integrated circuit, attaching a heatspreader having a force control protrusion on the substrate, and forming an encapsulant over the heatspreader and the integrated circuit.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: March 12, 2013
    Assignee: STATS Chippac Ltd.
    Inventors: Emmanuel Espiritu, Dario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Rachel Layda Abinan, Allan Ilagan
  • Integrated circuit packaging system with interconnect and method of manufacture thereof
    Patent number: 8344495
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: January 1, 2013
    Assignee: Stats Chippac Ltd.
    Inventors: Zigmund Ramirez Camacho, Philip Lyndon Cablao, Lionel Chien Hui Tay, Frederick Rodriguez Dahilig
  • Integrated circuit packaging system with interconnect and method of manufacture thereof
    Patent number: 8304921
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: November 6, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Zigmund Ramirez Camacho, Henry Descalzo Bathan, Allan P. Ilagan, Philip Lyndon Cablao
  • Integrated circuit package system having interconnect stack and external interconnect
    Patent number: 8138080
    Abstract: An integrated circuit package system is provided forming an integrated circuit die having a first bond pad provided thereon, forming an interconnect stack on a first external interconnect, and connecting the interconnect stack to the first bond pad.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: March 20, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Dario S. Filoteo, Jr., Leo A. Merilo, Philip Lyndon Cablao, Emmanuel Espiritu, Rachel Layda Abinan, Allan Ilagan
  • Stacked integrated circuits package system with passive components
    Patent number: 8026129
    Abstract: A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: September 27, 2011
    Assignee: STATS ChipPAC Ltd.
    Inventors: Philip Lyndon Cablao, Dario S. Filoteo, Jr., Leo A. Merilo, Emmanuel Espiritu, Rachel Layda Abinan, Allan Ilagan
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20110140261
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway.
    Type: Application
    Filed: December 11, 2009
    Publication date: June 16, 2011
    Inventors: Zigmund Ramirez Camacho, Philip Lyndon Cablao, Lionel Chien Hui Tay, Frederick Rodriguez Dahilig
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF MANUFACTURE THEREOF
    Publication number: 20110115065
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.
    Type: Application
    Filed: November 13, 2009
    Publication date: May 19, 2011
    Inventors: Zigmund Ramirez Camacho, Henry Descalzo Bathan, Allan P. Ilagan, Philip Lyndon Cablao
  • Integrated circuit packaging system with interposer
    Patent number: 7911046
    Abstract: An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
    Type: Grant
    Filed: February 24, 2009
    Date of Patent: March 22, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Philip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Jr., Allan P. Ilagan
  • INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
    Publication number: 20100224991
    Abstract: An integrated circuit heat spreader stacking system includes: an integrated circuit on a substrate; a heat spreader having a heat sink dome; a stacking stand-off for the heat spreader; and the heat spreader mounted with the heat sink dome over the integrated circuit.
    Type: Application
    Filed: May 17, 2010
    Publication date: September 9, 2010
    Inventors: Dario S. Filoteo, JR., Emmanuel Espiritu, Philip Lyndon Cablao
  • Integrated circuit heat spreader stacking method
    Patent number: 7759169
    Abstract: An integrated circuit heat spreader stacking system is provided including mounting an integrated circuit on a substrate, forming a heat spreader, forming a stacking stand-off for the heat spreader, and mounting a heat spreader over the integrated circuit.
    Type: Grant
    Filed: July 11, 2006
    Date of Patent: July 20, 2010
    Assignee: Stats Chippac Ltd.
    Inventors: Dario S. Filoteo, Jr., Emmanuel Espiritu, Philip Lyndon Cablao
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD-FRAME PADDLE SCHEME FOR SINGLE AXIS PARTIAL SAW ISOLATION
    Publication number: 20100001384
    Abstract: An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.
    Type: Application
    Filed: July 1, 2008
    Publication date: January 7, 2010
    Inventors: Henry Descalzo Bathan, Il Kwon Shim, Zigmund Ramirez Camacho, Philip Lyndon Cablao, Jose Alvin Caparas
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
    Publication number: 20090152704
    Abstract: An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
    Type: Application
    Filed: February 24, 2009
    Publication date: June 18, 2009
    Inventors: Philip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Jr., Allan P. Ilagan
  • Integrated circuit packaging system with interposer
    Patent number: 7518226
    Abstract: An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: April 14, 2009
    Assignee: Stats Chippac Ltd.
    Inventors: Philip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Jr., Allan P. Ilagan
  • Integrated circuit package-in-package system
    Patent number: 7439620
    Abstract: An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: October 21, 2008
    Assignee: Stats Chippac Ltd.
    Inventors: Leo A. Merilo, Emmanuel Espiritu, Philip Lyndon Cablao, Dario S. Filoteo, Jr.
  • INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
    Publication number: 20080185719
    Abstract: An integrated circuit packaging system is provided including forming an interposer having a coupling slot, securing an upper die on the interposer, mounting the interposer over an integrated circuit, and coupling the integrated circuit to the upper die through the coupling slot.
    Type: Application
    Filed: February 6, 2007
    Publication date: August 7, 2008
    Inventors: Philip Lyndon Cablao, Rachel Layda Abinan, Dario S. Filoteo, Allan P. Ilagan
  • INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
    Publication number: 20080029905
    Abstract: An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 7, 2008
    Applicant: STATS CHIPPAC LTD.
    Inventors: Leo A. Merilo, Emmanuel Espiritu, Philip Lyndon Cablao, Dario S. Filoteo
  • INTEGRATED CIRCUIT HEAT SPREADER STACKING SYSTEM
    Publication number: 20080012122
    Abstract: An integrated circuit heat spreader stacking system is provided including mounting an integrated circuit on a substrate, forming a heat spreader, forming a stacking stand-off for the heat spreader, and mounting a heat spreader over the integrated circuit.
    Type: Application
    Filed: July 11, 2006
    Publication date: January 17, 2008
    Applicant: STATS ChipPAC Ltd.
    Inventors: Dario S. Filoteo, Emmanuel Espiritu, Philip Lyndon Cablao