Abstract: A hardware retention mechanism comprising a frame including a first guide shoulder and a pivot point; an actuator arm including a first guide post; and a first shape memory alloy wire strung between the first guide shoulder and the first guide post that rotates the actuator arm between a locked position and an unlocked position. The actuator arm is rotatable around the pivot point between a locked position and an unlocked position. In some embodiments, the frame may further comprise a second guide shoulder, the actuator arm may further comprise a second guide post, and a second shape memory alloy wire may be strung between the second guide shoulder and the second guide post that rotates the actuator arm between an unlocked position and a locked position.

Abstract: A hardware retention mechanism comprising a frame including a first guide shoulder and a pivot point; an actuator arm including a first guide post; and a first shape memory alloy wire strung between the first guide shoulder and the first guide post that rotates the actuator arm between a locked position and an unlocked position. The actuator arm is rotatable around the pivot point between a locked position and an unlocked position. In some embodiments, the frame may further comprise a second guide shoulder, the actuator arm may further comprise a second guide post, and a second shape memory alloy wire may be strung between the second guide shoulder and the second guide post that rotates the actuator arm between an unlocked position and a locked position.

Abstract: A hardware retention mechanism comprising a frame including a first guide shoulder and a pivot point; an actuator arm including a first guide post; and a first shape memory alloy wire strung between the first guide shoulder and the first guide post that rotates the actuator arm between a locked position and an unlocked position. The actuator arm is rotatable around the pivot point between a locked position and an unlocked position. In some embodiments, the frame may further comprise a second guide shoulder, the actuator arm may further comprise a second guide post, and a second shape memory alloy wire may be strung between the second guide shoulder and the second guide post that rotates the actuator arm between an unlocked position and a locked position.

Abstract: A method, apparatus, and computer program product for load shedding during an emergency power off event. In one embodiment, power is supplied from a main power source to a plurality of electrical loads within a device enclosure. Power loss is detected from the main power source. Upon detecting the power loss, at least one of the electrical loads is disconnected from a supplemental power source such that power to at least one remaining load connected to the supplemental power source is sustained by the supplementary power source.

Abstract: An input/output (I/O) and disk expansion subsystem is provided for an electronics rack which provides expanded I/O and/or disk storage capabilities to electronic subsystems of the rack. The expansion subsystem includes a subsystem enclosure having first and second sides in opposing relation, with the first side accessible through a front of the rack and the second accessible through a back of the rack when the enclosure resides within the rack. A plurality of field-replaceable units reside within the subsystem enclosure, and are accessible and removable through the first or second sides of the enclosure without removing the enclosure from the rack. The field-replaceable units include an input/output adapter cage(s), a storage device cage, power and control supplies, fan assemblies, and a midplane connector assembly. The adapter cage, storage device cage, and power and control supply dock to and are electrically interconnected by the midplane connector assembly.

Abstract: An energy management control method and controller reduce power supply current and/or subsystem cooling overhead that reduces system efficiency, may reduce system reliability and may increase ambient noise. Multiple device connectors are supplied from corresponding soft switches that are programmed to provide a current level that is sufficient to supply the maximum current for the device installed in the corresponding device connector. The current level may be determined from device information provided from the device during initialization, which may directly specify a maximum current requirement. Alternatively, the maximum current requirement can be determined from other device-identifying information such as a unique device identifier. As a result a guaranteed maximum current or power and power dissipation can be determined, and multiple power supplies and/or cooling devices such as air movement devices (AMDs) may be enabled, disabled or otherwise controlled accordingly.

Abstract: A hardware retention mechanism comprising a frame including a first guide shoulder and a pivot point; an actuator arm including a first guide post; and a first shape memory alloy wire strung between the first guide shoulder and the first guide post that rotates the actuator arm between a locked position and an unlocked position. The actuator arm is rotatable around the pivot point between a locked position and an unlocked position. In some embodiments, the frame may further comprise a second guide shoulder, the actuator arm may further comprise a second guide post, and a second shape memory alloy wire may be strung between the second guide shoulder and the second guide post that rotates the actuator arm between an unlocked position and a locked position.

Abstract: An input/output (I/O) and disk expansion subsystem is provided for an electronics rack which provides expanded I/O and/or disk storage capabilities to electronic subsystems of the rack. The expansion subsystem includes a subsystem enclosure having first and second sides in opposing relation, with the first side accessible through a front of the rack and the second accessible through a back of the rack when the enclosure resides within the rack. A plurality of field-replaceable units reside within the subsystem enclosure, and are accessible and removable through the first or second sides of the enclosure without removing the enclosure from the rack. The field-replaceable units include an input/output adapter cage(s), a storage device cage, power and control supplies, fan assemblies, and a midplane connector assembly. The adapter cage, storage device cage, and power and control supply dock to and are electrically interconnected by the midplane connector assembly.

Abstract: A method, apparatus, and computer program product for load shedding during an emergency power off event. In one embodiment, power is supplied from a main power source to a plurality of electrical loads within a device enclosure. Power loss is detected from the main power source. Upon detecting the power loss, at least one of the electrical loads is disconnected from a supplemental power source such that power to at least one remaining load connected to the supplemental power source is sustained by the supplementary power source.

Abstract: An electronic system enclosure including cooling units to regulate temperature of electrical components therein. In one embodiment, the electronic system enclosure includes field replaceable units which facilitate concurrent maintenance. In this embodiment, air pressure within the electronic system enclosure is maintained while a field replaceable unit is removed. Also in this embodiment, cooling of the remaining electrical components of the electronic system enclosure is continued during removal of a field replaceable unit.

Abstract: An energy management control method and controller reduce power supply current and/or subsystem cooling overhead that reduces system efficiency, may reduce system reliability and may increase ambient noise. Multiple device connectors are supplied from corresponding soft switches that are programmed to provide a current level that is sufficient to supply the maximum current for the device installed in the corresponding device connector. The current level may be determined from device information provided from the device during initialization, which may directly specify a maximum current requirement. Alternatively, the maximum current requirement can be determined from other device-identifying information such as a unique device identifier. As a result a guaranteed maximum current or power and power dissipation can be determined, and multiple power supplies and/or cooling devices such as air movement devices (AMDs) may be enabled, disabled or otherwise controlled accordingly.

Abstract: Monitoring a plurality of field-replaceable units (FRUs) in an enclosure using two or more microcontroller-equipped power supplies to detect an FRU failure. Upon detection of an FRU failure, a first signal indicative of the failure is communicated from at least one of the microcontroller-equipped power supplies to one or more small computer system interface (SCSI) repeaters over an I2C bus. The one or more SCSI repeaters report a second signal indicative of the failure to one or more central electronics complexes (CECs) over one or more SCSI busses. The first signal may, but need not, be substantially identical to the second signal.

Abstract: Methods, systems and computer products for SCSI power control, data flow and addressing. Exemplary embodiments include a SCSI system having a SCSI bus with a plurality of data lines, including a first repeater configuration, a second repeater configuration, a method for selectively enabling at least one of the first and second repeater configurations and a method for selectively assigning SCSI IDs on devices on a SCSI bus.

Abstract: An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.

Abstract: Method and apparatus to prevent disturbances on the system power busses in a data processing system while communication channels of the system are partitioned and redundant to eliminate interruptions. Power to Direct Access Storage Devices (DASD) and Terminators are powered-on in a slow controlled manner to prevent disturbances on the power busses. This allows for hot plugging of DASD backplanes. Very fast (1u sec.) soft switch circuits along with parasitic (Lparx) storage components provide over current protection from any shorting component or disk drive.

Abstract: An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.