Patents by Inventor Philip van Haaster
Philip van Haaster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9635789Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.Type: GrantFiled: April 27, 2015Date of Patent: April 25, 2017Assignee: Laird Technologies, Inc.Inventors: Gerald R. English, Joseph C. Boetto, Philip van Haaster
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Publication number: 20160242321Abstract: According to various aspects, exemplary embodiments are disclosed of mid-plates and EMI shields for electronic devices. In an exemplary embodiment, a mid-plate generally includes one or more recessed portions along a surface of the mid-plate. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader. The dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components. In another exemplary embodiment, a board level shield (BLS) generally includes a cover having one or more recessed portions along an inner surface of the cover. A heat spreader is within the one or more recessed portions. Dielectric is along an outward-facing surface of the heat spreader, whereby the dielectric inhibits the heat spreader from directly contacting and electrically shorting one or more components when the one or more components are under the BLS.Type: ApplicationFiled: June 9, 2015Publication date: August 18, 2016Inventors: Philip van Haaster, Joseph C. Boetto, Paul W. Crotty, JR., Kenneth M. Robinson, Jason L. Strader
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Publication number: 20160227679Abstract: According to various aspects, exemplary embodiments are disclosed of EMI shields with increased under-shield space and/or greater component clearance for one or more components under the shield. In an exemplary embodiment, a shield generally includes one or more recessed portions along an inner surface of the cover. Dielectric material is along the inner surface of the cover within at least the one or more recessed portions. The one or more recessed portions may provide increased under-shield space and/or greater clearance for one or more components under the shield. The dielectric material may inhibit the one or more recessed portions of the shield from directly contacting and electrically shorting one or more components when the one or more components are under the shield. Also disclosed are exemplary embodiments of methods relating to making EMI shields and methods relating to providing shielding for one or more components on a substrate.Type: ApplicationFiled: April 27, 2015Publication date: August 4, 2016Inventors: Gerald R. English, Joseph C. Boetto, Philip van Haaster
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Patent number: 7883340Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.Type: GrantFiled: November 30, 2009Date of Patent: February 8, 2011Assignee: Laird Technologies, Inc.Inventor: Philip van Haaster
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Publication number: 20100266246Abstract: An electromagnetic interference (EMI) shielding and/or grounding gasket generally includes one or more sides and slots along the one or more sides. Finger elements are defined by the slots. The finger elements include contact portions for electrically contacting at least one electrically conductive surface adjacent to a mounting surface when the gasket is mounted thereto with its one or more sides disposed about and in electrical contact with the mounting surface. The gasket may thus be operable for establishing an electrically conductive pathway between the electrically-conductive surface and the mounting surface.Type: ApplicationFiled: April 15, 2010Publication date: October 21, 2010Applicant: LAIRD TECHNOLOGIES, INC.Inventor: Philip van Haaster
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Patent number: 7763810Abstract: According to various aspects, exemplary embodiments are provided of fabric-over-foam EMI gaskets. In one exemplary embodiment, a fabric-over-foam EMI gasket generally includes a resiliently compressible foam core and an outer electrically-conductive fabric layer. At least one slit extends generally transversely across an upper surface portion of a longitudinally extending region of the gasket.Type: GrantFiled: February 4, 2008Date of Patent: July 27, 2010Assignee: Laird Technologies, Inc.Inventor: Philip van Haaster
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Publication number: 20100167600Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.Type: ApplicationFiled: November 30, 2009Publication date: July 1, 2010Applicant: Laird Technologies, Inc.Inventor: Philip van Haaster
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Patent number: 7625218Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.Type: GrantFiled: January 6, 2009Date of Patent: December 1, 2009Assignee: Laird Technologies, Inc.Inventor: Philip van Haaster
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Publication number: 20090114438Abstract: According to various aspects, exemplary embodiments are provided of fabric-over-foam EMI gaskets. In one exemplary embodiment, a fabric-over-foam EMI gasket generally includes a resiliently compressible foam core and an outer electrically-conductive fabric layer. At least one slit extends generally transversely across an upper surface portion of a longitudinally extending region of the gasket.Type: ApplicationFiled: February 4, 2008Publication date: May 7, 2009Applicant: LAIRD TECHNOLOGIES, INC.Inventor: Philip van Haaster
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Publication number: 20090111290Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.Type: ApplicationFiled: January 6, 2009Publication date: April 30, 2009Applicant: Laird Technologies, Inc.Inventor: Philip van Haaster
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Patent number: 7488181Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.Type: GrantFiled: June 4, 2007Date of Patent: February 10, 2009Assignee: Laird Technologies, Inc.Inventor: Philip van Haaster
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Publication number: 20080166927Abstract: According to various aspects, exemplary embodiments are provided of contacts that may be compatible with surface mount technology. The contacts may be surface mountable for establishing an electrical pathway (e.g., electrical grounding contact, etc.) from at least one electrically-conductive surface on the substrate to another electrically-conductive surface (e.g., EMI shield, battery contact, etc.). In one exemplary embodiment, a contact generally includes a resilient dielectric core member. At least one outer electrically-conductive layer is electrocoated onto the resilient dielectric core member. A solderable electrically-conductive base member may be coupled to the resilient core member and/or the outer electrically-conductive layer. The base member may be in electrical contact with the outer electrically-conductive layer.Type: ApplicationFiled: June 4, 2007Publication date: July 10, 2008Inventor: Philip van Haaster
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Patent number: 7135643Abstract: Lossy materials can be used to suppress EMI transmission. Disclosed are methods for applying lossy materials to EMI shielded enclosures to improve EMI shielding effectiveness and the EMI shielded enclosures so produced. In some embodiments, the EMI shielded enclosure includes a printed-circuit board mountable device. In one embodiment, lossy material can be applied to the interior of an EMI shielded enclosure using an adhesive. In another embodiment, lossy materials can be applied to the exterior of the EMI enclosure to suppress EMI incident upon the EMI shielded enclosure, thereby reducing the susceptibility of electronics contained within the EMI shielded enclosure. In yet another embodiment, lossy materials can be applied to both the interior and exterior of the EMI enclosure.Type: GrantFiled: December 13, 2002Date of Patent: November 14, 2006Assignee: Laird Technologies, Inc.Inventors: Philip van Haaster, Edward Nakauchi, Richard Norman Johnson
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Patent number: 6870092Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.Type: GrantFiled: December 4, 2002Date of Patent: March 22, 2005Assignee: Laird Technologies, Inc.Inventors: Michael Lambert, Jeff McFadden, Philip van Haaster
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Publication number: 20040001299Abstract: Lossy materials can be used to suppress EMI transmission. Disclosed are methods for applying lossy materials to EMI shielded enclosures to improve EMI shielding effectiveness and the EMI shielded enclosures so produced. In some embodiments, the EMI shielded enclosure includes a printed-circuit board mountable device. In one embodiment, lossy material can be applied to the interior of an EMI shielded enclosure using an adhesive. In another embodiment, lossy materials can be applied to the exterior of the EMI enclosure to suppress EMI incident upon the EMI shielded enclosure, thereby reducing the susceptibility of electronics contained within the EMI shielded enclosure. In yet another embodiment, lossy materials can be applied to both the interior and exterior of the EMI enclosure.Type: ApplicationFiled: December 13, 2002Publication date: January 1, 2004Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Philip van Haaster, Edward Nakauchi, Richard Norman Johnson
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Publication number: 20030192715Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.Type: ApplicationFiled: December 4, 2002Publication date: October 16, 2003Applicant: LAIRD TECHNOLOGIES, INC.Inventors: Michael Lambert, Jeff McFadden, Philip van Haaster
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Patent number: RE41594Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.Type: GrantFiled: September 5, 2006Date of Patent: August 31, 2010Assignee: Laird Technologies, Inc.Inventors: Michael Lambert, Jeff McFadden, Philip van Haaster
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Patent number: RE42512Abstract: Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e.g., plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb.Type: GrantFiled: November 10, 2008Date of Patent: July 5, 2011Assignee: Laird Technologies, Inc.Inventors: Michael R. Lambert, Jeff McFadden, Philip van Haaster
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Patent number: D728773Type: GrantFiled: May 8, 2012Date of Patent: May 5, 2015Assignee: Laird Technologies, Inc.Inventor: Philip van Haaster