Patents by Inventor PHILIPP OSCHMANN

PHILIPP OSCHMANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973434
    Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: April 30, 2024
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alexander Hensler, Philipp Oschmann, Hubert Schierling
  • Patent number: 11723177
    Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: August 8, 2023
    Assignee: Siemens Aktiengesellschaft
    Inventors: Thomas Bigl, Alexander Hensler, Stephan Neugebauer, Ewgenij Ochs, Philipp Oschmann, Stefan Pfefferlein, Ulrich Wetzel
  • Publication number: 20230215660
    Abstract: A film capacitor includes first and second contact layers and a metallized dielectric film with first and second end faces and with first and second film sides. The first end face of the metallized dielectric film is connected to the first contact layer and the second end face is connected to the second contact layer. The metallized dielectric film has first, second and third metallization layers, with at least two of the metallization layers applied on the first film side of the metallized dielectric film and at least a further of the metallization layers applied on the second film side. The metallization layers are arranged on the film sides in such a manner that a first overlap with a first partial capacitance and a second overlap with a second partial capacitance are embodied between the metallization layers on the film sides, with the partial capacitances forming a series connection.
    Type: Application
    Filed: May 4, 2021
    Publication date: July 6, 2023
    Applicant: Siemens Aktiengesellschaft
    Inventors: Marion Junghänel, Bernd KÜRTEN, Helmut BRENDEL, Alexander HENSLER, Philipp OSCHMANN, Gerd HILBINGER
  • Publication number: 20220407434
    Abstract: A rectifier has at least three outputs at which the rectifier provides a high potential, a low potential and at least one medium potential. Phase voltages of a supply grid can be supplied to the rectifier via feed lines. Inductors are arranged in the feed lines. A clamping circuit has two diode circuits that are connected in series. One of the end points of the series circuit is connected to an output at which the rectifier provides one of the medium potentials. The other end point is connected to another output. The node is connected to a reference potential via an overall capacitor circuit.
    Type: Application
    Filed: August 6, 2020
    Publication date: December 22, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: ALEXANDER HENSLER, PHILIPP OSCHMANN, HUBERT SCHIERLING
  • Patent number: 11431240
    Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier. The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: August 30, 2022
    Assignee: Siemens Aktiengesellschaft
    Inventors: Alexander Hensler, Philipp Oschmann
  • Publication number: 20220006395
    Abstract: A frequency converter includes a rectifier on an input side and a support capacitor downstream of the rectifier. Input-side phases of the rectifier feed the backup capacitor via multiple half-bridges of the rectifier. The half-bridges have active switching elements and the rectifier is designed as a recovery rectifier, The input-side phases are connected to grid-side phases of a multiphase supply grid via an upstream circuit. Each grid-side phase is connected to one of the input-side phases within the upstream circuit via a respective phase capacitor. A control facility controls the active switching elements when a first charge state of the support capacitor is reached and input-side phase voltages are applied to the input-side phases via the active switching elements. Voltages running in the opposite direction to the grid-side phase voltages are applied to the grid-side phases to which the input-side phases are connected via the phase capacitors.
    Type: Application
    Filed: September 19, 2019
    Publication date: January 6, 2022
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: ALEXANDER HENSLER, PHILIPP OSCHMANN
  • Publication number: 20220007543
    Abstract: A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.
    Type: Application
    Filed: October 31, 2019
    Publication date: January 6, 2022
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: THOMAS BIGL, ALEXANDER HENSLER, STEPHAN NEUGEBAUER, EWGENIJ OCHS, PHILIPP OSCHMANN, STEFAN PFEFFERLEIN, ULRICH WETZEL