Abstract: Disclosed herein include systems, apparatuses, devices, and methods for introducing one or more components into a fluid. A first fluid and a second fluid can be co-injected into a fluidic channel of a flow cell. In some embodiments, the first fluid and a second fluid are immiscible (e.g. an aqueous buffer and a non-aqueous liquid). In some embodiments, the second fluid is less dense than the first fluid.

Abstract: Disclosed herein include systems, apparatuses, devices, and methods for introducing one or more components into a fluid. A first fluid and a second fluid can be co-injected into a fluidic channel of a flow cell. In some embodiments, the first fluid and a second fluid are immiscible (e.g. an aqueous buffer and a non-aqueous liquid). In some embodiments, the second fluid is less dense than the first fluid.

Abstract: Disclosed herein are methods, devices, and systems for efficient loading and retrieval of particles. In some embodiments, a fluidic channel of a flowcell comprises a ceiling, a first sidewall, and a bottom, wherein the contact angle of the ceiling is at least 10 degrees smaller than the contact angle of the first sidewall, and wherein the bottom of the fluidic channel comprises a substrate that comprises a plurality of microwells.

Abstract: Disclosed herein are methods, devices, and systems for efficient loading and retrieval of particles. In some embodiments, a fluidic channel of a flowcell comprises a ceiling, a first sidewall, and a bottom, wherein the contact angle of the ceiling is at least 10 degrees smaller than the contact angle of the first sidewall, and wherein the bottom of the fluidic channel comprises a substrate that comprises a plurality of microwells.

Abstract: A method for adhesively bonding film-like substrates, in which a two-component polyurethane adhesive is applied to a film and then a second film is applied, a two-component polyurethane adhesive being used that consists of—a component A containing at least one prepolymer having at least two NCO groups,—a component B containing at least one polymeric or oligomeric crosslinker having at least two groups that react with NCO groups, wherein component B contains 0.05 to 5 wt. % of a low-molecular-weight compound C, which—should have a nucleophilic group that reacts with NCO groups and—contains a hydrogen-bridging group, selected from O?C—O? or O?C—C—O? or O?C—C?C—O? or protonated forms.

Abstract: A method for adhesively bonding film-like substrates, in which a two-component polyurethane adhesive is applied to a film and then a second film is applied, a two-component polyurethane adhesive being used that consists of—a component A containing at least one prepolymer having at least two NCO groups,—a component B containing at least one polymeric or oligomeric crosslinker having at least two groups that react with NCO groups, wherein component B contains 0.05 to 5 wt. % of a low-molecular-weight compound C, which—should have a nucleophilic group that reacts with NCO groups and—contains a hydrogen-bridging group, selected from O?C—O? or O?C—C—O? or O?C—C?C—O? or protonated forms.

Abstract: A solder-joint detection circuit uses a resistive bridge and a differential detector to detect faults in the solder-joint network both inside and outside the digital electronic package during operation. The resistive bridge is preferably coupled to a high supply voltage used to power the package. Resistors R1 and R2 are connected in series at a first junction between the high and low supply voltages and a resistor R3 is coupled to the high supply voltage and connected in series with the resistance of the solder-network at a second junction. The network is held at a low voltage on the die. The detector compares the sensitivity and detection voltages and outputs a Pass/Fail signal for the solder-joint network.

Abstract: The solder-joint integrity of digital electronic packages, such as FPGAs or microcontrollers that have internally connected input/output buffers, is evaluated by applying a time-varying voltage through one or more solder-joint networks to charge a charge-storage component. Each network includes an I/O buffer on the die in the package and a solder-joint connection, typically one or more such connections inside the package and between the package and a board. The time constant for charging the component is proportional to the resistance of the solder-joint network, hence the voltage across the charge-storage component is a measurement of the integrity of the solder-joint network.