Patents by Inventor Philippe COQUET

Philippe COQUET has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11264688
    Abstract: An interposer (16) and a substrate (10) incorporating the interposer (16) are provided. The interposer (16) includes one or more layers (18) and a cavity (20) defined in the one or more layers (18), the cavity (20) being configured as a waveguide for propagation of electromagnetic waves.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: March 1, 2022
    Assignees: THALES SOLUTIONS ASIA PTE LTD, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, UNIVERSITE GRENOBLES ALPES, L'INSTITUT POLYTECHNIQUE DE GRENOBLE, UNIVERSITE DES SCIENCES ET TECHNOLOGIES DE LILLE 1, UNIVERSITÉ DE LIMOGES, NANYANG TECHNOLOGICAL UNIVERSITY
    Inventors: Philippe Coquet, Beng Kang Tay, Mathieu Cometto, Dominique Baillargeat, Stéphane Bila, Kamel Frigui, Philippe Ferrari, Emmanuel Pistono, Florence Podevin
  • Publication number: 20210214215
    Abstract: A nanostructure transfer method is provided. The method includes providing a first substrate (10) having thereon a plurality of nanostructures (12), the nanostructures (12) extending away from the first substrate (10). A solder material (14) is deposited on distal ends of the nanostructures (12). A second substrate (18) having thereon a first metal layer (20) is provided. The solder material (14) is bonded to the first metal layer (20), thereby attaching the nanostructures (12) to the second substrate (18). The attached nanostructures (12) are then released from the first substrate (10).
    Type: Application
    Filed: August 29, 2019
    Publication date: July 15, 2021
    Applicants: THALES SOLUTIONS ASIA PTE LTD, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, NANYANG TECHNOLOGICAL UNIVERSITY, UNIVERSITÉ DE LILLE
    Inventors: Jianxiong Wang, Philippe Coquet, Beng Kang Tay
  • Publication number: 20200325075
    Abstract: The invention relates to a composite material based on boron nitride (BN(C)) in the form of a continuous structure; and a phase change material (PCM) incorporated within said continuous BN(C) structure and is embedded within a polymer layer, a process for manufacturing same, and the components that comprise same.
    Type: Application
    Filed: December 21, 2018
    Publication date: October 15, 2020
    Inventors: Matthieu PAWLIK, Edwin Hang Tong TEO, Philippe COQUET
  • Publication number: 20200153074
    Abstract: An interposer (16) and a substrate (10) incorporating the interposer (16) are provided. The interposer (16) includes one or more layers (18) and a cavity (20) defined in the one or more layers (18), the cavity (20) being configured as a waveguide for propagation of electromagnetic waves.
    Type: Application
    Filed: May 23, 2018
    Publication date: May 14, 2020
    Inventors: Philippe COQUET, Beng Kang TAY, Mathieu COMETTO, Dominique BAILLARGEAT, Stéphane BILA, Kamel FRIGUI, Philippe FERRARI, Emmanuel PISTONO, Florence PODEVIN
  • Publication number: 20200115286
    Abstract: The present invention relates to a boron nitride (BN(C)) composite material in the form of a continuous structure, and a phase change material (PCM) included inside said continuous structure of (BN(C)), the method for manufacturing same and the components that comprise same.
    Type: Application
    Filed: May 16, 2018
    Publication date: April 16, 2020
    Inventors: Matthieu PAWLIK, Hang Tong Edwin TEO, Jêrôme FONCIN, Thomas MERLET, Philippe COQUET, Manuela LOEBLEIN, Tony Siu Hon TSANG