Patents by Inventor Philippe GAC

Philippe GAC has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11599764
    Abstract: The present invention relates to a prelaminate for an electronic card, wherein at least a first group of pads is formed from a metal plate formed from a piece comprising a central part and branches extending from the central part, the branches of the metal plate forming the pads of the first group. The invention also relates to a method for producing such a prelaminate and an electronic card comprising such a prelaminate.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: March 7, 2023
    Assignee: IDEMIA FRANCE
    Inventors: Philippe Gac, Pierre Escoffier, Rémi Lavarenne
  • Publication number: 20210279544
    Abstract: The present invention relates to a prelaminate for an electronic card, wherein at least a first group of pads is formed from a metal plate formed from a piece comprising a central part and branches extending from the central part, the branches of the metal plate forming the pads of the first group. The invention also relates to a method for producing such a prelaminate and an electronic card comprising such a prelaminate.
    Type: Application
    Filed: March 4, 2021
    Publication date: September 9, 2021
    Inventors: Philippe GAC, Pierre ESCOFFIER, Rémi LAVARENNE
  • Patent number: 10929736
    Abstract: Disclosed is an electronic device including: a body; a module enclosed in the body; a microcircuit and a direct current source, both forming part of the body; and an electronic component forming part of the module and accessible from the exterior, the electronic component being electrically connected to the microcircuit and having to be supplied with direct current from the direct current source. The body includes a first antenna connected to the direct current source via an oscillator and the module includes a second antenna connected to the electronic component via a rectifier circuit, the first and second antennas being electromagnetically coupled, providing a wireless radio frequency power supply to the electronic component of the module from the direct current source of the body.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: February 23, 2021
    Assignee: IDEMIA FRANCE
    Inventors: Philippe Gac, Denis Guerard, Ahmed Ali
  • Publication number: 20190228279
    Abstract: Disclosed is an electronic device including: a body; a module enclosed in the body; a microcircuit and a direct current source, both forming part of the body; and an electronic component forming part of the module and accessible from the exterior, the electronic component being electrically connected to the microcircuit and having to be supplied with direct current from the direct current source. The body includes a first antenna connected to the direct current source via an oscillator and the module includes a second antenna connected to the electronic component via a rectifier circuit, the first and second antennas being electromagnetically coupled, providing a wireless radio frequency power supply to the electronic component of the module from the direct current source of the body.
    Type: Application
    Filed: June 28, 2017
    Publication date: July 25, 2019
    Inventors: Philippe GAC, Denis GUERARD, Ahmed ALI
  • Patent number: 10147670
    Abstract: A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: December 4, 2018
    Assignee: IDEMIA FRANCE
    Inventors: Philippe Gac, Mickael Huet, Jean-Michel Fontaine
  • Publication number: 20180108595
    Abstract: A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.
    Type: Application
    Filed: April 1, 2016
    Publication date: April 19, 2018
    Inventors: Philippe GAC, Mickael HUET, Jean-Michel FONTAINE
  • Patent number: 9881247
    Abstract: A method is provided for producing a smart card including at least one chip and another electronic component having a face accessible from the outside. The method includes: forming a card body having two opposing faces and in which at least two recesses are formed, one being a through-recess extending from one of the faces to the other, forming a first module including the chip and forming a second module separate from the first module and including the other electronic component, the second module including a support to which the component is secured opposite the face that must be accessible, securing the second module in the through-recess from the face of the body that is opposite the face through which the face of the component must be accessible, via a shoulder in the through-recess, and securing the first module in the other recess.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: January 30, 2018
    Assignee: OBERTHUR TECHNOLOGIES
    Inventors: Loic Le Garrec, Philippe Gac
  • Publication number: 20150317554
    Abstract: A method for producing a smart card including at least one chip and at least one other electronic component having a face that must be accessible from the outside, includes: forming a card body having two opposing faces and in which at least two recesses are formed, one of which is a through-recess extending from one of the faces to the other, forming a first module including the chip and forming a second module separate from the first module and including the other electronic component, the second module including a support to which the component is secured opposite the face that must be accessible, securing the second module in the through-recess from the face of the body that is opposite the face through which the face of the component must be accessible from the outside, via a shoulder in the through-recess, and securing the first module in the other recess.
    Type: Application
    Filed: October 29, 2013
    Publication date: November 5, 2015
    Applicant: OBERTHUR TECHNOLOGIES
    Inventors: Loic LE GARREC, Philippe GAC