Patents by Inventor Philippe Jacot
Philippe Jacot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11854220Abstract: A system and a method for measuring the profile of a part. The measurement system includes a sensor with a probe having at least one degree of freedom, and a first reference element fastened to the probe. The sensor is arranged so that the probe is able to follow the internal or external contour of the part while the first reference element is outside the part. An imaging device is adapted to capture an image representing at least a portion of the outside of the part and the first reference element. Thus, the first reference element serves as a reference element for the position of the probe relative to the reference system that is the part.Type: GrantFiled: November 28, 2019Date of Patent: December 26, 2023Assignee: WATCHOUTCORP SAInventors: Philippe Jacot, Sébastien Laporte, Frédéric Perret
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Patent number: 11642749Abstract: A machine-tool including a machining module equipped with a tool-holder and a work-holder, and an optical measuring device-for the three-dimensional measurement of the relative position between the tool-holder and the work-holder. The optical measuring device includes an optical system mounted on the work-holder and a target mounted on the tool-holder. The target includes a useful face forming a positioning reference that can be placed in the optical axis of the optical system.Type: GrantFiled: November 29, 2018Date of Patent: May 9, 2023Assignee: LDI FINANCESInventors: Philippe Jacot, Sebastien Laporte, Frederic Perret
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Patent number: 11549801Abstract: A three-dimensional target capable of serving as a positioning reference, including, on a useful face, a first structure and a second structure. The first structure defines a planar reference face divided up between at least a first portion whose surface is reflective according to a diffuse reflection, and a second portion whose surface is reflective according to a specular reflection, the second portion being divided up according to a series of localized zones positioned in the first portion. The second structure has an inclined face relative to the planar reference face. Applicable to three-dimensional optical measurement of the relative position between a first object and a second object.Type: GrantFiled: November 29, 2018Date of Patent: January 10, 2023Assignee: LDI FINANCESInventors: Philippe Jacot, Sebastien Laporte, Frederic Perret
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Publication number: 20220250201Abstract: A material removing machining module for a machine tool including: a part support intended to receive a part to be machined, a control unit of the part support adapted to control and to modify the position of the part support in the machining module, a toolholder intended to receive a tool having an end portion used for machining the part; a control unit of the toolholder adapted to control and to modify the position of the toolholder in the machining module, a unit for detecting the profile of the tool mounted on the toolholder, which includes an optical system mounted on the toolholder for determining the profile of said end portion of the tool mounted on the toolholder.Type: ApplicationFiled: June 3, 2020Publication date: August 11, 2022Inventors: Philippe Jacot, Sébastien Laporte
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Publication number: 20220028106Abstract: A system and a method for measuring the profile of a part. The measurement system includes a sensor with a probe having at least one degree of freedom, and a first reference element fastened to the probe. The sensor is arranged so that the probe is able to follow the internal or external contour of the part while the first reference element is outside the part. An imaging device is adapted to capture an image representing at least a portion of the outside of the part and the first reference element. Thus, the first reference element serves as a reference element for the position of the probe relative to the reference system that is the part.Type: ApplicationFiled: November 28, 2019Publication date: January 27, 2022Inventors: Philippe Jacot, Sébastien Laporte, Frédéric Perret
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Publication number: 20210016407Abstract: A machine-tool including a machining module equipped with a tool-holder and a work-holder, and an optical measuring device-for the three-dimensional measurement of the relative position between the tool-holder and the work-holder. The optical measuring device includes an optical system mounted on the work-holder and a target mounted on the tool-holder. The target includes a useful face forming a positioning reference that can be placed in the optical axis of the optical system.Type: ApplicationFiled: November 29, 2018Publication date: January 21, 2021Inventors: Philippe Jacot, Sebastien Laporte
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Publication number: 20200408506Abstract: A three-dimensional target capable of serving as a positioning reference, including, on a useful face, a first structure and a second structure. The first structure defines a planar reference face divided up between at least a first portion whose surface is reflective according to a diffuse reflection, and a second portion whose surface is reflective according to a specular reflection, the second portion being divided up according to a series of localized zones positioned in the first portion. The second structure has an inclined face relative to the planar reference face. Applicable to three-dimensional optical measurement of the relative position between a first object and a second object.Type: ApplicationFiled: November 29, 2018Publication date: December 31, 2020Inventors: Philippe Jacot, Sebastien Laporte
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Patent number: 10710206Abstract: System for machining workpieces including a setting-up module and a machining module for the production of components. The setting-up module includes at least one first tool holder fixing device for fixing at least one tool holder removably, and at least one first workpiece support fixing device for fixing a workpiece support removably. The machining module includes at least one second tool holder fixing device for fixing at least one tool holder removably and at least one second workpiece support fixing device for fixing a workpiece support removably, such that the tool holder and the workpiece support can both be transferred from the setting-up module to the machining module after setting up.Type: GrantFiled: June 9, 2016Date of Patent: July 14, 2020Assignee: WATCH OUT SAInventors: Philippe Jacot, Sebastien Laporte
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Patent number: 10507528Abstract: A lathe including a moving headstock designed to rotate and move forward a workpiece to be turned in relation to an axis of translation and rotation. A guide bush is designed to be attached to a frame of the lathe and includes a bush spindle and a clamping mechanism. The guide bush is designed to operate either in bush mode or in grip mode and is designed to be moveable axially in relation to the frame along the axis of translation and rotation. The lathe is arranged to operate in a first mode in which the guide bush is driven axially by the moving headstock, and a second mode in which the axial position of the guide bush is static in relation to the frame.Type: GrantFiled: June 9, 2016Date of Patent: December 17, 2019Assignee: WATCH OUT SAInventors: Philippe Jacot, Sebastien Laporte
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Patent number: 10293446Abstract: A workpiece machining system including a setting-up module and a machining module for producing workpieces. The setting-up module includes at least one first tool-holder attachment device for removably attaching at least one tool-holder and at least one first workpiece-carrier attachment device for removably attaching a workpiece-carrier. The machining module includes at least one second tool-holder attachment device for removably attaching at least one tool-holder and at least one second workpiece-carrier attachment device—for removably attaching a workpiece-carrier, such that the tool-holder and the workpiece-carrier—can both be transferred after setting up from the setting-up module to the machining module.Type: GrantFiled: June 9, 2016Date of Patent: May 21, 2019Assignee: WATCH OUT SAInventors: Philippe Jacot, Sebastien Laporte
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Publication number: 20190111492Abstract: A lathe including a moving headstock designed to rotate and move forward a workpiece to be turned in relation to an axis of translation and rotation. A guide bush is designed to be attached to a frame of the lathe and includes a bush spindle and a clamping mechanism. The guide bush is designed to operate either in bush mode or in grip mode and is designed to be moveable axially in relation to the frame along the axis of translation and rotation. The lathe is arranged to operate in a first mode in which the guide bush is driven axially by the moving headstock, and a second mode in which the axial position of the guide bush is static in relation to the frame.Type: ApplicationFiled: June 9, 2016Publication date: April 18, 2019Applicant: Watch Out SAInventors: Philippe Jacot, Sébastien Laporte
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Patent number: 10175036Abstract: Method of measuring at least one dimension (L) of an object (1) having a first axis (2), the method including the use of a first optical system (11) including an optical sensor (111) and having a second optical axis (113), the measuring method including (i) obtaining at least one series of data from the optical sensor when the object is in movement relative to the first optical system, notably an angular movement of the first axis relative to the second axis and/or a movement of the object in rotation about the first axis and/or a movement of the object in translation along the second axis and (ii) processing the at least one series of data to quantify said at least one dimension.Type: GrantFiled: June 27, 2016Date of Patent: January 8, 2019Assignee: ROLEX SAInventors: Christian Mougin, Philippe Jacot, Olivier Perrinjaquet
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Publication number: 20180229340Abstract: A workpiece machining system including a setting-up module and a machining module for producing workpieces. The setting-up module includes at least one first tool-holder attachment device for removably attaching at least one tool-holder and at least one first workpiece-carrier attachment device for removably attaching a workpiece-carrier. The machining module includes at least one second tool-holder attachment device for removably attaching at least one tool-holder and at least one second workpiece-carrier attachment device-for removably attaching a workpiece-carrier, such that the tool-holder and the workpiece-carrier-can both be transferred after setting up from the setting-up module to the machining module.Type: ApplicationFiled: June 9, 2016Publication date: August 16, 2018Applicant: Watch Out SAInventors: Philippe Jacot, Sebastien Laporte
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Publication number: 20180222004Abstract: System for machining workpieces including a setting-up module and a machining module for the production of components. The setting-up module includes at least one first tool holder fixing device for fixing at least one tool holder removably, and at least one first workpiece support fixing device for fixing a workpiece support removably. The machining module includes at least one second tool holder fixing device for fixing at least one tool holder removably and at least one second workpiece support fixing device for fixing a workpiece support removably, such that the tool holder and the workpiece support can both be transferred from the setting-up module to the machining module after setting up.Type: ApplicationFiled: June 9, 2016Publication date: August 9, 2018Applicant: Watch Out SAInventors: Philippe Jacot, Sebastien Laporte
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Publication number: 20180222003Abstract: A machining unit including at least one machining module. The machining module includes a protective compartment that delimits an enclosure and has a front door, which can go from a closed position to an open position defining an opening. A machining assembly is provided with a tool-holder and a part-holder. A movable carriage receives the machining assembly and can slide on a guide device, between a first position in which the machining assembly is accommodated in the enclosure and a second position in which the carriage projects from the protective compartment via the opening and the machining assembly is situated outside the enclosure. In the first position, the front door can be closed for the purpose of carrying out machining of a part by the machining assembly. The second position permits access to the machining assembly from the exterior of the protective compartment.Type: ApplicationFiled: June 9, 2016Publication date: August 9, 2018Applicant: Watch Out SAInventors: Philippe Jacot, Sebastien Laporte
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Publication number: 20170003112Abstract: Method of measuring at least one dimension (L) of an object (1) having a first axis (2), the method including the use of a first optical system (11) including an optical sensor (111) and having a second optical axis (113), the measuring method including (i) obtaining at least one series of data from the optical sensor when the object is in movement relative to the first optical system, notably an angular movement of the first axis relative to the second axis and/or a movement of the object in rotation about the first axis and/or a movement of the object in translation along the second axis and (ii) processing the at least one series of data to quantify said at least one dimension.Type: ApplicationFiled: June 27, 2016Publication date: January 5, 2017Applicant: ROLEX SAInventors: Christian Mougin, Philippe Jacot, Olivier Perrinjaquet
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Patent number: 7148610Abstract: A surface acoustic wave device includes a transducer electrode formed on a substrate. In one aspect, the electrode has a plurality of layers. At least one of the layers is metal and another of the layers is a material for providing a hardening effect to the metal layer by reinforcement with Al2O3 precipitates. In another aspect, the electrode is electrically connected to a metal component that permits electrical connection of the surface acoustic wave device to an electrical device external to the surface acoustic wave device. The electrode has a metal portion of a first metallization. The component is of a second, different metallization. In other aspects, the surface acoustic wave device is made via a method to have such structural aspects.Type: GrantFiled: February 1, 2002Date of Patent: December 12, 2006Assignee: OC Oerlikon Balzers AGInventors: Philippe Jacot, Philippe Krebs, Christian Lambert
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Publication number: 20030146674Abstract: A surface acoustic wave device includes a transducer electrode formed on a substrate. In one aspect, the electrode has a plurality of layers. At least one of the layers is metal and another of the layers is a material for providing a hardening effect to the metal layer by reinforcement with Al2O3 precipitates. In another aspect, the electrode is electrically connected to a metal component that permits electrical connection of the surface acoustic wave device to an electrical device external to the surface acoustic wave device. The electrode has a metal portion of a first metallization. The component is of a second, different metallization. In other aspects, the surface acoustic wave device is made via a method to have such structural aspects.Type: ApplicationFiled: February 1, 2002Publication date: August 7, 2003Inventors: Philippe Jacot, Philippe Krebs, Christian Lambert
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Patent number: 6566274Abstract: A method of creating an undercut sidewall profile within an opening formed in a positive resist layer disposed upon a transparent substrate includes the step of forming a positive resist layer on the upper surface of the substrate, and optically patterning the resist layer by selectively directing light at the resist layer from above the upper surface of the substrate. The lower surface of the substrate is flooded with light to partially expose the lowermost region of the resist layer, and the exposed resist is dissolved to form patterned openings therein. The resulting sidewalls of the patterned resist openings have an enlarged width adjacent the upper surface of the substrate. The sidewalls of the resist layer are then flooded with light from above the substrate, the upper region of the resist layer is cured by an electron beam, and the resist layer is developed a second time to dissolve exposed portions of the resist sidewalls, thereby forming an undercut resist sidewall profile.Type: GrantFiled: November 28, 2001Date of Patent: May 20, 2003Assignee: Unaxis Balzer LimitedInventors: Philippe Jacot, Hubert Choffat