Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses, and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract: Method for testing packet-based semiconductor devices by using simplified test data packets. Simplified test data packets are generated by conventional memory testers in one format. The simplified test data packets are realigned to another, different format by test mode circuitry located on an integrated circuit chip, test interface, or tester prior to testing the memory device. The test method potentially reduces the number of pieces of data which must be generated using an algorithmic pattern generator on a per-pin basis. Furthermore, the test method potentially reduces the number of packet words that has a combination of data generated from an APG and vector memory. Packet-based semiconductor devices are also disclosed.

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract: The invention provides an apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract: The invention provides an apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.

Abstract: A voltage is applied across a control resistor, and the voltage is caused to decay. The decay is monitored by a testing circuit such as a comparator. When the voltage across the control resistor has decayed to a value less than or equal to a reference voltage in the comparator, a switch time period is established. Fuses in a memory device are tested against the established switch time period. The fuses are tested in a similar fashion: a voltage is applied across the fuse being tested, and the voltage is caused to decay. The comparator monitors the decay of the voltage across the fuse. If the resistance value of a fuse being tested is within specification, the comparator changes its state at a time equal to or less than the switch time period established for the control resistor. Testing time for fuses can further be minimized by having an external access to the reference in the comparator.

Abstract: An apparatus, system, and method for testing packet-based semiconductor devices by using simplified test data packets. Simplified test data packets are generated by conventional memory testers in one format. The simplified test data packets are realigned to another, different format by test mode circuitry located on an integrated circuit chip, test interface, or tester prior to testing the memory device. The test method potentially reduces the number of pieces of data which must be generated using an algorithmic pattern generator on a per-pin basis. Furthermore, the test method potentially reduces the number of packet words that has a combination of data generated from an APG and vector memory. Packet-based semiconductor devices are also disclosed.

Abstract: The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.

Abstract: Method for testing packet-based semiconductor devices by using simplified test data packets. Simplified test data packets are generated by conventional memory testers in one format. The simplified test data packets are realigned to another, different format by test mode circuitry located on an integrated circuit chip, test interface, or tester prior to testing the memory device. The test method potentially reduces the number of pieces of data which must be generated using an algorithmic pattern generator on a per-pin basis. Furthermore, the test method potentially reduces the number of packet words that has a combination of data generated from an APG and vector memory. Packet-based semiconductor devices are also disclosed.

Abstract: Probe cards configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. In embodiments of the invention, protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. In this regard, methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card of the present invention is also provided.

Abstract: A method for probe cards configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. In embodiments of the invention, protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. In this regard, methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card of the present invention is also provided.

Abstract: Probe cards configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. In embodiments of the invention, protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. In this regard, methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card of the present invention is also provided.

Abstract: The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.

Abstract: The invention provides a method and apparatus for temporarily isolating a die from other dice on a wafer commonly connected to one or more common conductors. The conductors are connected to each die through a temporary isolation device, such as a diode. The common conductor supplies a signal to all dice during one set of test procedures, while the temporary isolation device can be used to isolate a die from the common conductor during another set of test procedures.

Abstract: The present invention relates to probe cards configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. In preferred embodiments of the invention, protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses, and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. In this regard, methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card of the present invention is also provided.

Abstract: A voltage is applied across a control resistor, and the voltage is caused to decay. The decay is monitored by a testing circuit such as a comparator. When the voltage across the control resistor has decayed to a value less than or equal to a reference voltage in the comparator, a switch time period is established. Fuses in a memory device are tested against the established switch time period. The fuses are tested in a similar fashion: a voltage is applied across the fuse being tested, and the voltage is caused to decay. The comparator monitors the decay of the voltage across the fuse. If the resistance value of a fuse being tested is within specification, the comparator changes its state at a time equal to or less than the switch time period established for the control resistor. Testing time for fuses can further be minimized by having an external access to the reference in the comparator.

Abstract: A voltage is applied across a control resistor, and the voltage is caused to decay. The decay is monitored by a testing circuit such as a comparator. When the voltage across the control resistor has decayed to a value less than or equal to a reference voltage in the comparator, a switch time period is established. Fuses in a memory device are tested against the established switch time period. The fuses are tested in a similar fashion: a voltage is applied across the fuse being tested, and the voltage is caused to decay. The comparator monitors the decay of the voltage across the fuse. If the resistance value of a fuse being tested is within specification, the comparator changes its state at a time equal to or less than the switch time period established for the control resistor. Testing time for fuses can further be minimized by having an external access to the reference in the comparator.