Abstract: A method and circuit for implementing multiple active paths between source and destination devices in an interconnect system while removing ghost packets, and a design structure on which the subject circuit resides are provided. Each packet includes a generation ID and is assigned an End-to-End (ETE) sequence number in the source interconnect chip that represents the packet position in an ordered packet stream from the source device. The packets are transmitted from a source interconnect chip source to a destination interconnect chip on the multiple active paths. The generation ID of a received packet is compared with a current generation ID at a destination interconnect chip to validate packet acceptance. The destination interconnect chip uses the ETE sequence numbers to reorder the accepted received packets into the correct order before sending the packets to the destination device.

Abstract: A method and circuit for implementing ordered and reliable transfer of packets while spraying packets over multiple links, and a design structure on which the subject circuit resides are provided. Each source interconnect chip maintains a spray mask including multiple available links for each destination chip for spraying packets across multiple links of a local rack interconnect system. Each packet is assigned an End-to-End (ETE) sequence number in the source interconnect chip that represents the packet position in an ordered packet stream from the source device. The destination interconnect chip uses the ETE sequence numbers to reorder the received sprayed packets into the correct order before sending the packets to the destination device.

Abstract: A method and circuit for implementing enhanced link bandwidth for a headless interconnect chip in a local rack interconnect system, and a design structure on which the subject circuit resides are provided. The headless interconnect chip includes a cut through switch and a store and forward switch. A packet is received from an incoming link to be transmitted on an outgoing link on the headless interconnect chip. Both the cut through switch and the store and forward switch are selectively used for moving packets received from the incoming link to the outgoing link on the headless interconnect chip.

Abstract: A method and circuit for implementing enhanced link bandwidth for a headless interconnect chip in a local rack interconnect system, and a design structure on which the subject circuit resides are provided. The headless interconnect chip includes a cut through switch and a store and forward switch. A packet is received from an incoming link to be transmitted on an outgoing link on the headless interconnect chip. Both the cut through switch and the store and forward switch are selectively used for moving packets received from the incoming link to the outgoing link on the headless interconnect chip.