Patents by Inventor Phodi Han

Phodi Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead-free solder paste
    Publication number: 20060180245
    Abstract: A lead-free solder paste suitable for soldering components in electronic or microelectronic circuitry including a solder powder and a flux medium. The flux medium includes at least one colored dye material and at least one fluorescent dye material. The solder paste upon melting undergoes a color change from a colored state to a colorless metallic state and the melted solder paste fluoresces under black light.
    Type: Application
    Filed: February 15, 2005
    Publication date: August 17, 2006
    Inventors: Tippy Wicker, Phodi Han
  • Soldering composition
    Patent number: 5435857
    Abstract: A soldering composition consisting essentially of an alloy comprising tin, indium, antimony, silver and in the range of 0.0% to about 10.5% by weight bismuth.
    Type: Grant
    Filed: January 6, 1994
    Date of Patent: July 25, 1995
    Assignee: Qualitek International, Inc.
    Inventors: Tippy H. Han, Phodi Han