Patents by Inventor Phuah Kian Keung

Phuah Kian Keung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded integrated circuit packages and methods of forming the same
    Patent number: 11114367
    Abstract: A package is disclosed. The package includes a leadframe, and a first die, attached to the leadframe. The package also includes first bond wires, each attached to one of the first bond pads of the first die and to one of the leads of the leadframe, and a package body molded over each of a portion of the die pad of the leadframe, a portion of the leads of the leadframe, a first portion of the first die, and one or more of the first bond wires. The molded package body defines a cavity, and a second portion of the first die contacts neither of the die pad and the package body. The package also includes a second die having second bond pads, where the second die is attached to the first die. The package also includes second bond wires, each attached to the first and second die.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: September 7, 2021
    Assignee: Carsem (M) SDN. BHD.
    Inventors: Lily Khor, Phuah Kian Keung
  • MOLDED INTEGRATED CIRCUIT PACKAGES
    Publication number: 20200219800
    Abstract: A package is disclosed. The package includes a leadframe, and a first die, attached to the leadframe. The package also includes first bond wires, each attached to one of the first bond pads of the first die and to one of the leads of the leadframe, and a package body molded over each of a portion of the die pad of the leadframe, a portion of the leads of the leadframe, a first portion of the first die, and one or more of the first bond wires. The molded package body defines a cavity, and a second portion of the first die contacts neither of the die pad and the package body. The package also includes a second die having second bond pads, where the second die is attached to the first die. The package also includes second bond wires, each attached to the first and second die.
    Type: Application
    Filed: September 10, 2019
    Publication date: July 9, 2020
    Applicant: Carsem (M) SDN. BHD.
    Inventors: Lily Khor, Phuah Kian Keung
  • Stress-free lead frame
    Patent number: 7786554
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: August 31, 2010
    Assignee: Carsem (M) Sdn. Bhd.
    Inventors: Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu, Liow Eng Keng, Thum Min Kong, Chen Choon Hing
  • Stress-free lead frame
    Patent number: 7288833
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: October 30, 2007
    Assignee: Carsem (M) Sdn. Bhd.
    Inventors: Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu, Liow Eng Keng, Thum Min Kong, Chen Choon Hing
  • Stress-free lead frame
    Patent number: 6867483
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: March 15, 2005
    Assignee: Carsen Semiconductor SDN. BHD.
    Inventors: Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu, Liow Eng Keng, Thum Min Kong, Chen Choon Hing
  • Method for sawing a moulded leadframe package
    Patent number: 6544817
    Abstract: The present invention relates to a new method for sawing a moulded leadframe package (1) into individual integrated circuits (11). In the present invention sawing of the moulded leadframe package (1) is done on the leads (13) instead of on the connecting bar (14) resulting in less heat being generated during cutting. This results in higher cutting speed and longer dicing blade life.
    Type: Grant
    Filed: June 22, 2001
    Date of Patent: April 8, 2003
    Assignee: Carsem Semiconductor SDN. BHD.
    Inventors: Lee Kock Huat, Chan Boon Meng, Phuah Kian Keung, Lee Huan Sin, Cheong Mun Tuck
  • Stress-free lead frame
    Publication number: 20020105063
    Abstract: The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
    Type: Application
    Filed: July 20, 2001
    Publication date: August 8, 2002
    Inventors: Lee Kock Huat, Chan Boon Meng, Cheong Mun Tuck, Lee Huan Sin, Phuah Kian Keung, Araventhan Eturajulu, Liow Eng Keng, Thum Min Kong, Chen Choon Hing
  • Method for sawing a moulded leadframe package
    Publication number: 20020048850
    Abstract: The present invention relates to a new method for sawing a moulded leadframe package (1) into individual integrated circuits (11). In the present invention sawing of the moulded leadframe package (1) is done on the leads (13) instead of on the connecting bar (14) resulting in less heat being generated during cutting. This results in higher cutting speed and longer dicing blade life.
    Type: Application
    Filed: June 22, 2001
    Publication date: April 25, 2002
    Inventors: Lee Kock Huat, Chan Boon Meng, Phuah Kian Keung, Lee Huan Sin, Cheong Mun Tuck