Patents by Inventor Phuong Nguyen Duy DAO

Phuong Nguyen Duy DAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HOLLOW PARTICLE, METHOD OF PRODUCING THE HOLLOW PARTICLE, RESIN COMPOSITION, AND RESIN MOLDED PRODUCT AND LAMINATE EACH USING THE RESIN COMPOSITION
    Publication number: 20220363551
    Abstract: Provided is a hollow particle, including silica, having a DSL of primary particles that satisfies the following expression (1), and having a breaking strength of 10 MPa or more: 1?DSL?1.5 . . . (1) where DSL=D75L/D25L, and D25L and D75L represent a 25th value and a 75th value, respectively, when long diameters of 100 randomly selected primary particles are measured in observation with a scanning electron microscope and sorted in order of increasing size.
    Type: Application
    Filed: May 6, 2022
    Publication date: November 17, 2022
    Applicant: KYOWA CHEMICAL INDUSTRY CO., LTD.
    Inventors: Phuong Nguyen Duy DAO, Tsukasa NAKAMURA