Abstract: A system for determining a distance between a receiver and a transmitter are disclosed herein. The transmitter includes a first antenna array having a first spatial orientation and is configured to transmit a signal. The receiver includes a second antenna array and an orientation sensor to determine a second spatial orientation of the second antenna array and is configured to receive the signal. A logic circuit is configured compare the first spatial orientation to the second spatial orientation to determine a relative orientation of the second antenna array; determine an angle of arrival of the signal; identify, based on the relative orientation of the second antenna array and the angle of arrival of the signal, a received signal strength compensation value; and calculate a distance between the transmitter and the receiver based on a measured received signal strength of the signal and the identified compensation value.

Abstract: A system for determining a distance between a receiver and a transmitter are disclosed herein. The transmitter includes a first antenna array having a first spatial orientation and is configured to transmit a signal. The receiver includes a second antenna array and an orientation sensor to determine a second spatial orientation of the second antenna array and is configured to receive the signal. A logic circuit is configured compare the first spatial orientation to the second spatial orientation to determine a relative orientation of the second antenna array; determine an angle of arrival of the signal; identify, based on the relative orientation of the second antenna array and the angle of arrival of the signal, a received signal strength compensation value; and calculate a distance between the transmitter and the receiver based on a measured received signal strength of the signal and the identified compensation value.

Abstract: A radio frequency (RF) device includes a spatial orientation sensor and logic circuit configured to determine spatial orientation of the RF device relative to a reference position or relative to a RF transmitter. In particular, the RF device determines a distance between the RF receiver and the RF transmitter based on a received signal strength of the signal and a determined spatial orientation of the RF device, by determining an orientation compensation value from a stored orientation compensation profile and determining a resulting compensated received signal strength. The RF device is thereby able to determine distance in an orientationally-invariant manner.

Abstract: Methods, systems and apparatus for detecting object location and generating alerts are disclosed herein. An example disclosed method includes determining an assigned area for an object being handled by a loader; detecting a first location of the loader; determining whether the first location corresponds to the assigned area for the object; and in response to the first location not corresponding to the assigned area for the object, generating a first output indicative of a difference between the first location and the assigned area for the object.

Abstract: A radio frequency (RF) device includes a spatial orientation sensor and logic circuit configured to determine spatial orientation of the RF device relative to a reference position or relative to a RF transmitter. In particular, the RF device determines a distance between the RF receiver and the RF transmitter based on a received signal strength of the signal and a determined spatial orientation of the RF device, by determining an orientation compensation value from a stored orientation compensation profile and determining a resulting compensated received signal strength. The RF device is thereby able to determine distance in an orientationally-invariant manner.

Abstract: Methods, systems and apparatus for detecting object location and generating alerts are disclosed herein. An example disclosed method includes determining an assigned area for an object being handled by a loader; detecting a first location of the loader; determining whether the first location corresponds to the assigned area for the object; and in response to the first location not corresponding to the assigned area for the object, generating a first output indicative of a difference between the first location and the assigned area for the object.

Abstract: Methods, systems and apparatus for detecting object location and generating alerts are disclosed herein. An example disclosed method includes determining an assigned area for an object being handled by a loader; detecting a first location of the loader; determining whether the first location corresponds to the assigned area for the object; and in response to the first location not corresponding to the assigned area for the object, generating a first output indicative of a difference between the first location and the assigned area for the object.

Abstract: In accordance with one or more embodiments, a flange package comprises a flange and an interposer having two or more fingers disposed in an interposer trench. The flange has a mold lock formed about a periphery of the interposer trench. A dielectric ring comprising a dielectric material is formed in the interposer trench, and in and around the periphery of the mold lock. A semiconductor die is disposed within the dielectric ring having gate pads and source pads formed on a first side, and having drain pads disposed on a second side of the die. The gate pads are coupled to the interposer and the source pads are coupled to the flange. A gate lead is coupled to the interposer and a drain lead is coupled to the drain pads. Other embodiments are disclosed.

Abstract: In accordance with one or more embodiments, a flange package comprises a flange and an interposer having two or more fingers disposed in an interposer trench. The flange has a mold lock formed about a periphery of the interposer trench. A dielectric ring comprising a dielectric material is formed in the interposer trench, and in and around the periphery of the mold lock. A semiconductor die is disposed within the dielectric ring having gate pads and source pads formed on a first side, and having drain pads disposed on a second side of the die. The gate pads are coupled to the interposer and the source pads are coupled to the flange. A gate lead is coupled to the interposer and a drain lead is coupled to the drain pads. Other embodiments are disclosed.

Abstract: In accordance with one or more embodiments, a flange package comprises a flange and an interposer having two or more fingers disposed in an interposer trench. The flange has a mold lock formed about a periphery of the interposer trench. A dielectric ring comprising a dielectric material is formed in the interposer trench, and in and around the periphery of the mold lock. A semiconductor die is disposed within the dielectric ring having gate pads and source pads formed on a first side, and having drain pads disposed on a second side of the die. The gate pads are coupled to the interposer and the source pads are coupled to the flange. A gate lead is coupled to the interposer and a drain lead is coupled to the drain pads. Other embodiments are disclosed.