Abstract: An integrated light-emitting device includes a substrate, a reflecting layer containing at least one reflector cup molded over the substrate to define a cup-shaped recess and having a reflective surface in the cup-shaped recess, a light-generating source mounted on the substrate within the cup-shaped recess, an encapsulating layer molded over the cup-shaped recess and the light-generating source, and a brightness enhancement prism film attached onto the encapsulating layer and patterned to form a plurality of prism structures.

Abstract: A concave cup printed circuit board includes a substrate and a cup forming plate. The substrate has an electrical circuitry and at least one contact pad connected to the circuitry. The cup forming plate has at least one through-hole and at least one cup-shaped wall confining the through-hole. The cup forming plate overlies and is connected to the substrate such that the through-hole is disposed over the contact pad. The cup forming plate and the substrate are fabricated separately. The through-hole is formed in the cup forming plate before the cup forming plate is connected to the substrate.

Abstract: A concave cup printed circuit board includes a substrate and a cup forming plate. The substrate has an electrical circuitry and at least one contact pad connected to the circuitry. The cup forming plate has at least one through-hole and at least one cup-shaped wall confining the through-hole. The cup forming plate overlies and is connected to the substrate such that the through-hole is disposed over the contact pad. The cup forming plate and the substrate are fabricated separately. The through-hole is formed in the cup forming plate before the cup forming plate is connected to the substrate.