Abstract: A device (12) picks up at least one semi-conductor wafer (11) from a container (14) of wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant. The device is on the opposite side (17) of the aperture and the pick-up is effected through it. The device incorporates a shutter (1) movable between open and closed positions. A wafer picking up means (2) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means (3) moves the picking up means (2) back and forth through the aperture (13).

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: A substrate measurement system including a measurement chamber and a substrate handling chamber possessing a substrate transfer and a substrate container interface arranged to receive a substrate to container. The handling chamber contains a first interface to connect the measurement chamber and the measurement chamber contains a second interface to connect the handling chamber. The transfer means is arranged to transfer substrates between the container and the measurement chamber through the handling chamber, in which system a second measurement chamber is provided, having the same second interface as the first measurement chamber to replace latter chamber.

Abstract: A device and process are provided for identifying characters inscribed on a semiconductor wafer containing an orientation mark. A semiconductor wafer having characters inscribed on a surface near its periphery is supported about its periphery between three rotary supports mounted on a grasping arm. An orientation mark on the periphery of the wafer is located adjacent the inscribed characters. At least one of the three rotary supports is rotatably driven to orient the wafer such that the orientation mark is placed in a determined position. An optical reflector is positioned in a spatial zone in proximity to and above the characters to be identified. The characters to be identified are illuminated by a light beam reflected by the optical reflector. The characters reflect the light, which may be observed by an optical imager, such as a camera. An optical recognition subsystem may then be used to identify the characters.

Abstract: A device (12) to pick up at least one disc-shaped semi-conductor wafer (11) from a container (14) of such wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant, the device being situated on the opposite side (17) of the said aperture and the pick-up being effected through it. The device incorporates: A moving shutter (1) designed to move between a first, closed aperture, position and a second, open aperture, position that allows access to the inside of the container. A means of moving (18) this shutter between these first and second positions, the said movement taking place, at least in part, in a plane approximately parallel to the plane of the aperture.

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: A device and process are provided for identifying characters inscribed on a semiconductor wafer containing an orientation mark. A semiconductor wafer having characters inscribed on a surface near its periphery is supported about its periphery between three rotary supports mounted on a grasping arm. An orientation mark on the periphery of the wafer is located adjacent the inscribed characters. At least one of the three rotary supports is rotatably driven to orient the wafer such that the orientation mark is placed in a determined position. An optical reflector is positioned in a spatial zone in proximity to and above the characters to be identified. The characters to be identified are illuminated by a light beam reflected by the optical reflector. The characters reflect the light, which may be observed by an optical imager, such as a camera. An optical recognition subsystem may then be used to identify the characters.

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a, rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: Substrate measurement system including a measurement chamber (30), and a substrate handling chamber (7) possessing substrate transfer means (10) and a substrate container interface (1) arranged two receive a substrate container (8), the handling chamber (7) containing a first interface (50) to connect the measurement chamber (30), the measurement chamber (30) containing a second interface (51) to connect the handling chamber (7), and the transfer means (10) being arranged to transfer substrates between the container (8) and the measurement chamber (30) through the handling chamber (7), in which system a second measurement chamber (39) is provided, having the same second interface (51) as the first measurement chamber (30) to replace the latter chamber (30).

Abstract: Substrate measurement system including a measurement chamber (30), and a substrate handling chamber (7) possessing substrate transfer means (10) and a substrate container interface (1) arranged to receive a substrate container (8), the handling chamber (7) containing an interface (50) to connect the measurement chamber (30), the measurement chamber (30) containing an interface (51) to connect to the handling chamber (7), and the transfer means (10) being arranged to transfer substrates between the container (8) and the measurement chamber (30) through the handling chamber (7), in which a second measurement chamber (39) is provided, having the same interface (51) as the first measurement chamber (30) to replace the latter chamber (30).