Abstract: This invention provides a method and device for imposing and determining mechanical stress and/or strain, on micro-scale and nano-scale beams, films or multi-layers of materials such as metallic materials, polymer materials, ceramic materials, carbon-based materials and silicon-based materials using a set of micro- or nano-machines. The present invention also provides methods to derive and modify various properties or state of such nano- or microstructures, among others mechanical properties, and to measure the external stimulus that they are subjected to.