Abstract: In a high-density integrated circuit having a multilayered metal interconnection network, a planarization layer is formed over a lower metal layer which includes conductors having steep edges by chemically depositing a dielectric layer in the vapor phase over the lower metal layer so as to fill up hollows formed in the dielectric layer in intervals between the conductors, spreading a viscous layer of spin-on-glass over the dielectric layer, annealing the spin-on-glass layer to form a compact mass, forming vias through the spin-on-glass and dielectric layers to the conductors, and applying an upper metal layer over the spin-on-glass layer so as to fill the vias and provide electrical contacts to the conductors of the lower metal layer.

Abstract: A method of forming a planarization layer over a multilayered metal network which interconnects the components of a high-density integrated circuit and which includes conductors having steep edges disposed over a substrate. A layer of spin-on-glass is applied over the lower metal layer so as to have a thickness substantially equal to that of the lower metal layer and to form a thin film over the conductors. The spin-on-glass layer is uniformly etched to expose the upper surfaces of the conductors, and a dielectric layer is applied onto the etched spin-on-glass layer and upper surfaces of the conductors.

Abstract: A device possessing three conduction states comprises two electrodes connected with one another through the agency of a compound in the form C.sub.x H.sub.y in which there are held in suspension particles of vanadium oxide, VO.sub.2, the proportion by volume being of the order of 7%.

Abstract: A lamp for installation in the flashers or winkers of motor vehicles, with a flasher device integrated into the lamp itself, is provided. The flashing is produced, in the case of the invention, by the utilization of substances which exhibit a sudden change in resistivity at a certain temperature. This is the case with powdered V O.sub.2 when formed into an aglomerate by the use of an organic binder. A block assembled in the bulb of the lamp and in electrical parallel with the filament, does not effect the incandescent state of the latter as long as a temperature of 68.degree. C is not exceeded, but effectively short-circuits the filament beyond this temperature. In this fashion, successive extinctions and relightings take place by a process of relaxation. In the case of a C.sub.36 H.sub.74 wax filled with conductive powder, the phenomena are reversed and the block must be connected in series with the filament.