Abstract: A process for manufacturing an electronic module intended to be implemented in a dual-interface portable object is provided. The process includes at least the following steps: Using a single-sided film consisting of one or more contact regions and a dielectric comprising one or more apertures, Using a substrate comprising one or more electrically conductive regions intended for the contactless communication of the object, Securing said single-sided film and said substrate together, Positioning an integrated circuit and connecting it to the contact regions of the single-sided film and at least to one terminal of at least one of said electrically conductive regions, Depositing a protective layer incorporating at least said integrated circuit. Also provided is a module obtained by means of the process.

Abstract: A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.

Abstract: A method for manufacturing inserts provided with an electronic module supporting a chip and an antenna includes supplying top and bottom substrate sheets for a plurality of inserts, said substrates being provided with cavities for subsequently inserting an electronic module in each cavity; providing an antenna for each insert; providing at least one layer of adhesive; providing stacking and assembling by lamination a bottom substrate sheet, a first layer of adhesive, a plurality of antennas, a second layer of adhesive and a top substrate sheet; cutting the laminated assembly to obtain inserts each provided with an antenna; inserting electronic modules in the cavities after the step of laminating the substrate sheets, antennas and layers of adhesive. The method also includes printing the inner surface of at least one of the substrate sheets with a thickness-compensation layer, outside the substrate area intended for receiving the antenna.

Abstract: The invention concerns a method for producing a portable object having a card format and comprising:—an object body including a plastic support sheet (12), a plastic incorporation sheet (18), and a first (19) and second (20) external covering sheet; an antenna (11) provided with two antenna terminals (13); and an integrated circuit chip (14) incorporated in an incorporation sheet (18) and electrically connected to the antenna. The method of the invention is characterised in that it comprises stages according to which: the support sheet (12) on which the chip (14) has been mounted with the incorporation sheet (18) so as to obtain a first rolled unit; and in a subsequent stage the first rolled unit is covered with the first (19) and second (20) external covering sheets. The invention can be applied in particular to the production of contactless cards by means of hot rolling.